Resin Composition for PCB Lamination Flow and Peel Strength
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Solution Overview
Problem
Existing resin-coated copper materials face challenges in achieving optimal resin flow rate, filling property, pattern integrity, copper foil peeling strength, thermal expansion, and thermal resistance during the layer build-up process of printed circuit boards, which are crucial for high-density interconnect applications.
Innovation Solution
A resin composition comprising divinylbenzene-styrene-ethylene copolymer and acryloyloxy group-containing compounds, formulated to enhance the performance of resin-coated copper, laminates, and printed circuit boards by improving filling property, pattern integrity, and thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resin-coated copper is used for layer build-up, then the process can be implemented, but the resin flow rate is uncontrolled and filling property is insufficient
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin by incorporating specific ratios of divinylbenzene-styrene-ethylene copolymer (5-25 parts) and acryloyloxy group-containing compounds (2-15 parts), which changes the resin's flow characteristics and filling behavior during lamination to achieve both controlled flow rate and sufficient filling property
Solution Approach 2:
The patent creates a composite resin system combining multiple components (divinylbenzene-styrene-ethylene copolymer, acryloyloxy group-containing compounds, and optionally other resins or additives) to achieve synergistic effects that simultaneously improve filling property and enable controlled resin flow rate
2Length of moving object
If resin-coated copper is applied for layer build-up, then layer thickness is reduced, but copper foil peeling strength decreases
Solution Approach 1:
The patent adjusts the chemical and physical parameters of the resin composition, including the incorporation of acryloyloxy group-containing compounds that form strong chemical bonds with copper foil, to maintain high peeling strength even when using thinner layers in high-density interconnect applications
3Reliability
If conventional resin composition is used, then manufacturing is simple, but thermal resistance and thermal expansion control are insufficient
Solution Approach 1:
The patent modifies the resin composition parameters by incorporating specific compounds with controlled thermal properties, achieving improved thermal resistance and coefficient of thermal expansion control while maintaining reasonable composition complexity for industrial manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves superior filling property, pattern integrity, copper foil peeling strength, and thermal resistance, making it suitable for high-performance laminates and circuit boards with improved thermal stability and reliability.
Implementation Method 1
a resin composition, comprising: 5 parts by weight to 25 parts by weight of a divinylbenzene-styrene-ethylene copolymer; and 2 parts by weight to 15 parts by weight of an acryloyloxy group-containing compound
Implementation Method 2
the pattern at the edge of a circuit-containing laminate after lamination, the coefficient of thermal expansion
Data Source
AI summary
A resin composition is provided, comprising 5 parts by weight to 25 parts by weight of a divinylbenzene-styrene-ethylene copolymer and 2 parts by weight to 15 parts by weight of an acryloyloxy group-containing compound, comprising an acryloyloxy group-containing compound having a structure represented by Formula (1), an acryloyloxy group-containing compound having a structure represented by Formula (2), an acryloyloxy group-containing compound having a structure represented by Formula (3) or an acryloyloxy group-containing compound having a structure represented by Formula (4). Also, an article made from the resin composition is provided, comprising a resin-coated copper, a laminate or a printed circuit board that has improvements in one or more properties.