Thermally Conductive Resin Heat Dissipation for PCB

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Solution Overview

Problem

Existing heat dissipation techniques for electronic devices fail to efficiently dissipate heat without altering the device design, leading to localized temperature increases and potential burn hazards, especially when heat-generating elements on both sides of a printed circuit board generate varying amounts of heat.

Innovation Solution

A heat dissipation structure utilizing a printed circuit board with heat-generating elements on both sides, where one side is surrounded by a thermally conductive curable liquid resin composition with a higher thermal conductivity than the surrounding layer, allowing controlled heat dissipation and preventing overheating, and optionally incorporating an electromagnetic shielding case.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat-dissipating sheets are used, then heat dissipation is provided, but contact area with non-smooth surfaces is reduced, leading to insufficient heat transfer

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidcontact area

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The patent changes the physical state of the heat dissipation material from solid sheet to curable liquid resin. The liquid resin can flow and adapt to non-smooth surfaces, maximizing contact area. After curing, it maintains this conformal contact while providing effective heat dissipation path.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The curable liquid resin acts as a flexible medium that can conform to irregular surfaces of heat-generating elements. Unlike rigid heat-dissipating sheets, the liquid resin adapts to surface irregularities, ensuring maximum contact area and efficient heat transfer.

Inventive Principle:

Principle #30Flexible shells and thin films

2Temperature

If thermally conductive resin is applied to front and back surfaces, then heat dissipation is improved, but heat is conducted to portions contacting human body, causing burn risk

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidburn injury risk

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies different thermal conductivity properties to different regions. The resin between heat-generating elements has high thermal conductivity for efficient heat dissipation, while the resin in human contact areas has lower thermal conductivity to prevent burn injuries. This localized property differentiation resolves the contradiction between heat dissipation efficiency and safety.

Inventive Principle:

Principle #3Local quality

3Temperature

If multiple substrates are used for heat dissipation, then heat transfer is improved, but device thickness increases and miniaturization becomes difficult

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoiddevice thickness

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

The patent merges the heat dissipation function with the existing resin structures already present in the device. Instead of adding separate heat dissipation substrates, the invention utilizes and optimizes the resin layers between components, achieving heat dissipation without increasing device thickness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The resin serves multiple functions simultaneously: it provides electrical insulation between components, mechanical bonding, and heat dissipation. This multi-functionality eliminates the need for additional dedicated heat dissipation substrates, maintaining device compactness while achieving effective heat management.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively dissipates heat generated by electronic components on both sides of the printed circuit board, controlling thermal conduction direction and preventing overheating, while maintaining the device's miniaturized and reduced thickness design, thus enhancing performance and safety by preventing burn hazards.

Implementation Method 1

a thermally conductive curable liquid resin composition, which is cured to control thermal conduction direction

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9826623B2Heat dissipating structure

Publication Date: 2017.11.21 KANEKA CORP

AI summary

A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.