Resin Composition Phase Separation for PCB Heat Resistance
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Solution Overview
Problem
Existing resin compositions for high-function printed wiring boards face challenges in achieving a balance between low elasticity, high elongation percentage, insulation reliability, heat resistance, and adhesive properties, particularly in thin glass cloth-based prepregs, where heat resistance and insulation reliability are compromised due to phase separation issues between acrylic polymers and thermosetting resins.
Innovation Solution
A resin composition is developed with a phase separation structure of an acrylic polymer and a thermosetting resin, where the average domain size of the thermosetting resin phase is 20 μm or less, and the solubility parameter difference between the two is controlled between 0.1 and 5.0, allowing for a sea-island structure that enhances both the acrylic polymer's flexibility and the thermosetting resin's heat resistance and adhesive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the glass cloth thickness is reduced to 30 μm or less to achieve high densification, then the printed wiring board can be downsized, but heat resistance and insulation reliability deteriorate
Solution Approach 1:
The patent uses a composite resin composition consisting of an acrylic polymer (providing flexibility and low elasticity) and a thermosetting resin (providing heat resistance and insulation reliability). This composite material structure allows the thin glass cloth-based prepreg to simultaneously achieve downsizing while maintaining heat resistance and insulation reliability, resolving the contradiction between thickness reduction and performance maintenance.
2Reliability
If a resin composition with phase separation structure is used to achieve both flexibility and heat resistance, then the characteristic features of both acrylic polymer and thermosetting resin are enhanced, but the control of phase separation domain size becomes difficult
Solution Approach 1:
The patent controls the solubility parameter difference between the acrylic polymer and thermosetting resin within a specific range (0.1 to 5.0) to regulate phase separation. By adjusting this critical parameter, the invention achieves proper phase separation domain size (20 μm or less) that balances flexibility and heat resistance while avoiding excessive phase separation that would compromise material homogeneity.
3Reliability
If the solubility parameter difference between acrylic polymer and thermosetting resin is large, then phase separation is enhanced, but adhesive properties to metal foil deteriorate
Solution Approach 1:
The patent optimizes the solubility parameter difference within the range of 0.1 to 5.0, which is sufficient to form a proper phase separation structure for enhancing flexibility and heat resistance, but not so large as to severely compromise adhesive properties to metal foil. This parameter optimization resolves the contradiction between phase separation enhancement and adhesive property maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent low elasticity, high elongation percentage, insulation reliability, and heat resistance, while maintaining strong adhesive properties to metal foils, effectively addressing the limitations of previous compositions by regulating the phase separation structure and solubility parameters.
Implementation Method 1
a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less
Implementation Method 2
the solubility parameter difference between the two is controlled between 0.1 and 5.0
Data Source
AI summary
The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.