Resin Plate Housing for Lightweight Rigid Electronics
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Solution Overview
Problem
Existing electronic devices with metal plates integrated into the housing face challenges in achieving a balance between rigidity and weight, often resulting in devices that are either too heavy or lack convenience due to metal plate-induced radio wave interference and heat management issues.
Innovation Solution
An electronic device design featuring a first case with a resin plate and display, where the resin plate acts as a heat buffer and supports the circuit board, enhancing rigidity while being lightweight, and incorporating a communication antenna for efficient wireless communication, with a heat transfer sheet for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal plate is insert molded into the housing to enhance rigidity, then the structural strength is improved, but the device becomes heavier and experiences radio wave interference
Solution Approach 1:
The patent changes the material parameter from metal to resin, transforming the housing from a metal-insert-molded structure to a resin-based structure with integrated reinforcing elements. This parameter change maintains structural rigidity while significantly reducing weight and eliminating radio wave interference issues associated with metal plates.
Solution Approach 2:
The patent employs composite material construction by integrating reinforcing elements (such as ribs or strengthening structures) directly into the resin housing material. This composite approach achieves the rigidity previously obtained from metal plates while utilizing the weight and electromagnetic advantages of resin materials.
2Strength
If a metal plate is used in the housing, then structural strength is improved, but heat management deteriorates due to heat diffusion to the display
Solution Approach 1:
The patent changes the thermal parameter by replacing metal material with resin material in the housing construction. Resin has lower thermal conductivity than metal, which naturally reduces heat diffusion to the display while maintaining structural integrity through optimized resin-based reinforcing structures.
3Weight of moving object
If a resin plate is used instead of metal plate, then weight is reduced and radio wave interference is eliminated, but structural rigidity may be compromised
Solution Approach 1:
The patent applies local quality enhancement by incorporating reinforcing elements (such as ribs, strengthening structures, or optimized wall thickness in critical areas) into the resin housing at specific locations where structural support is needed. This localized reinforcement maintains overall rigidity while preserving the weight and electromagnetic advantages of resin material throughout the housing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides a lightweight electronic device with enhanced rigidity and convenience by reducing heat diffusion to the display, minimizing the risk of overheating, and allowing for efficient wireless communication without radio wave interference.
Implementation Method 1
the resin plate acts as a heat buffer and supports the circuit board, enhancing rigidity while being lightweight
Implementation Method 2
incorporating a communication antenna for efficient wireless communication, with a heat transfer sheet for improved thermal management
Data Source
AI summary
An electronic device comprises a first case, a resin plate, and a display. The first case has a first surface and a second surface. The resin plate is located inside the first case. The display is located on a side facing the first surface of the first case.