Resin Composition for Printed Circuit Boards Using Polyether Modifier
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Solution Overview
Problem
Conventional resin compositions for printed circuit boards often suffer from insufficient wettability and adhesion issues with reinforcing materials and metal foils, leading to voids and potential short circuits, especially under high temperature, humidity, and voltage conditions.
Innovation Solution
A resin composition comprising epoxy resin, a hardener, and a modifier derived from an N,O-heterocyclic compound, which undergoes ring-opening polymerization to enhance wettability and adhesion, comprising specific steps of dissolving the N,O-heterocyclic compound in a solvent, heating for polymerization, and cooling to terminate the process, resulting in a polymer solution that improves interface bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin composition is used, then the manufacturing process is simple, but the wettability with reinforcing material is insufficient causing voids
Solution Approach 1:
The patent uses a composite resin system combining epoxy resin with polyether polyol modifier to achieve both good wettability and adhesion. The polyether polyol component specifically improves wetting of glass fiber surfaces while the epoxy resin provides structural integrity, creating a synergistic composite material that resolves the contradiction between simple composition and high performance.
Solution Approach 2:
The patent modifies the resin composition by changing the chemical parameters - specifically adding polyether polyol with specific molecular weight and hydroxyl value ranges. This parameter change transforms the resin's surface properties to enhance wettability without significantly complicating the overall composition formulation.
2Reliability
If conventional resin composition is used, then the adhesion to metal foil is poor, but improving adhesion may increase manufacturing complexity
Solution Approach 1:
The polyether polyol modifier in the composite resin system provides excellent adhesion to metal foil surfaces through its molecular structure containing both polar and non-polar segments. This same modifier that improves wettability also enhances metal adhesion, allowing a single compositional change to address both interface bonding issues simultaneously.
3Reliability
If voids are present at interfaces, then the printed circuit board may function, but electric leakage and short circuits occur under high temperature, humidity and voltage conditions
Solution Approach 1:
The patent applies preliminary anti-action by pre-treating the resin composition to eliminate void formation before the product is exposed to harsh environmental conditions. The modified resin ensures complete wetting and adhesion during manufacturing, preventing voids from forming in the first place, thereby protecting against future electrical failures under temperature, humidity, and voltage stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified resin composition effectively prevents voids between the resin and reinforcing materials, enhances adhesion with metal foils, and reduces the risk of short circuits, as demonstrated by improved peeling strength and wettability in printed circuit board applications.
Implementation Method 1
heating the first reaction solution to a first temperature to carry out a ring-opening polymerization to provide a solution of ring-opening polymerized product
Data Source
AI summary
A resin composition is provided. The resin composition comprises an epoxy resin, a hardener, and a modifier, wherein the modifier is a polymer solution obtainable from the following steps:(a) dissolving an N,O-heterocyclic compound of Formula I or Formula II into a first solvent to form a first reaction solution:(b) heating the first reaction solution to a first temperature to carry out a ring-opening polymerization to provide a solution of ring-opening polymerized product; and(c) cooling the solution of ring-opening polymerized product to a second temperature to substantially terminate the ring-opening polymerization to obtain the polymer solution,wherein, the first solvent is unreactive to the N,O-heterocyclic compound; the first temperature is higher than the softening temperature of the N,O-heterocyclic compound and lower than the boiling point of the first solvent; and the second temperature is lower than the first temperature.