Resin-Recessed Electronic Module Assembly for Lower-Cost Packaging
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Solution Overview
Problem
The manufacturing costs of semiconductor devices are high due to the requirement of sealing with resin, grinding, and removal of silicon support substrates, which complicates the process and increases expenses.
Innovation Solution
An electronic module design where a semiconductor element and an electronic component are mounted on a common module substrate, with a resin layer having recessed portions to accommodate them, allowing for simultaneous mounting and reduced manufacturing costs by eliminating the need for separate substrate removal processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor element is sealed with sealing resin and silicon support substrate is removed by etching, then characteristics of semiconductor element are improved, but manufacturing cost increases and process complexity increases
Solution Approach 1:
The patent extracts and removes the silicon support substrate from the semiconductor element structure through etching, eliminating the harmful effects of the silicon substrate on device characteristics while maintaining the benefits of SOI technology
Solution Approach 2:
The patent performs preliminary actions by forming through-holes and filling them with conductive material before final assembly, and by pre-positioning the semiconductor element on the module substrate to simplify subsequent manufacturing steps
2Reliability
If semiconductor element is sealed with sealing resin and silicon support substrate is removed by etching, then characteristics of semiconductor element are improved, but process complexity increases
Solution Approach 1:
The patent merges multiple functions into integrated structures: the through-holes serve both as mechanical support and electrical connection pathways, and the conductive material filling provides both structural stability and electrical connectivity between layers
Solution Approach 2:
The patent segments the device into distinct functional layers (semiconductor element layer, module substrate layer, encapsulant layer) with clear interfaces, allowing independent optimization and simplifying the manufacturing process for each layer
3Manufacturing precision
If semiconductor element and electronic component are mounted separately, then mounting precision can be maintained, but manufacturing cost increases
Solution Approach 1:
The patent combines the mounting of semiconductor element and electronic component into a single integrated assembly process on the module substrate, reducing the number of separate mounting operations while maintaining precision through unified positioning structures
Data Source
AI summary
A semiconductor element having a structure in which a wiring layer, an element formation layer, and a first insulating layer are stacked is mounted on a first surface of a module substrate in a state where the wiring layer faces the module substrate. The electronic component is mounted on the first surface of the module substrate. A resin layer is on the first surface of the module substrate. First and second recessed portions are in the resin layer, a semiconductor element is in the first recessed portion, and the electronic component is in the second recessed portion. When the first surface is set as a height reference, an upper surface of the resin layer includes a region which is higher than or equal to heights of an upper surface of the semiconductor element and an upper surface of the electronic component, around the semiconductor element and the electronic component.