Resin Sealed Cable Insertion for Electronic Device
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Solution Overview
Problem
Conventional electronic devices with exposed cables in harsh environments face issues with liquid intrusion due to capillary action, where existing sealing methods require manual peeling of insulation coatings, leading to inconsistent sealing quality and potential short-circuiting.
Innovation Solution
An electronic device design featuring a cable with one end drawn into a casing and the other end exposed, where the area from the opening portion to the bonded portion between the core wire and relay connection member is continuously sealed with resin, using a fixed-shaped relay connection member and a holding member to separate multiple relay connection members, preventing liquid intrusion and short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual peeling of insulation coating is performed to seal gaps between core wires, then liquid intrusion prevention is improved, but manufacturing consistency and reliability deteriorate due to human error and inconsistent sealing quality
Solution Approach 1:
The resin material automatically fills and seals the gaps between core wires through its own flow properties during the molding process, eliminating the need for manual peeling and sealing operations. The system serves itself by using the resin's natural characteristics to achieve consistent sealing without human intervention.
Solution Approach 2:
The manual mechanical process of peeling insulation coating and applying sealant is replaced by an automated resin injection molding process. The resin is injected under controlled pressure to fill gaps, substituting human labor with a automated mechanical system that ensures consistent sealing quality.
2Reliability
If manual peeling and sealing processes are used, then liquid intrusion prevention is addressed, but manufacturing efficiency and productivity deteriorate due to time-consuming operations
Solution Approach 1:
Multiple separate operations (cable insertion, insulation peeling, gap sealing, and assembly) are merged into a single integrated resin injection molding process. The resin injection step simultaneously achieves gap filling, sealing, and bonding functions, dramatically reducing manufacturing steps and improving productivity.
Solution Approach 2:
The resin is pre-prepared and stored in a ready-to-inject state before the molding process. The injection molding machine is pre-configured with the resin material and parameters, allowing the sealing operation to be performed immediately when the cable assembly is inserted, eliminating preparation time during actual manufacturing.
3Reliability
If manual peeling of insulation is performed, then gap sealing is achieved, but device complexity increases due to additional processing steps and quality control requirements
Solution Approach 1:
The complex manual peeling and sealing operations are extracted from the manufacturing process and replaced by a single resin injection molding step. The insulation coating is not peeled at all; instead, the resin is injected directly into the cable groove to seal gaps, removing unnecessary process steps and simplifying the overall manufacturing流程.
4Reliability
If resin is used to seal gaps between core wires, then liquid intrusion prevention is improved, but resin leakage and short-circuiting risks worsen if sealing precision is insufficient
Solution Approach 1:
The resin is selectively applied only to the specific gap regions between core wires within the cable groove, rather than coating the entire cable assembly. The injection molding process controls resin flow to fill only the necessary spaces, ensuring complete gap sealing while preventing resin from reaching areas where it could cause short-circuits.
Solution Approach 2:
The cable groove structure acts as an intermediary channel that guides the resin flow precisely to the gap areas. The groove confines the resin during injection, ensuring it fills gaps between core wires while preventing uncontrolled spread and potential short-circuiting, serving as a physical mediator between the resin and the core wires.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient and stable manufacturing of electronic devices, ensuring reliable prevention of liquid intrusion and short-circuiting, even in harsh environments, by maintaining consistent sealing quality and preventing resin leakage.
Implementation Method 1
there is a case in which a liquid intruding into a gap between outer and inner sheaths of the covered wire or a gap between the inner sheath and a conductive wire intrudes into the electronic device due to a capillary action
Data Source
AI summary
To provide an electronic device which can be efficiently manufactured with stable quality. A photoelectric sensor 1A includes a cable 20 of which one end is drawn into a casing 10 through a cable insertion opening portion 10c, and a lead frame 25 which is electrically connected to a circuit board 34. A conductive wire 23 of the cable 20 is bonded to the lead frame 25, and an area from the cable insertion opening portion 10c to the bonded portion between the conductive wire 23 and the lead frame 25 is continuously sealed with resin R.