Resin-Sealed Onboard Control Device Heat Dissipation
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Solution Overview
Problem
Conventional resin sealing methods for electronic control devices in vehicles face issues with heat dissipation, as flexible heat dissipating materials can flow or deform, leading to insufficient heat dissipation, stress on components, and reliability concerns due to resin flow and incomplete filling of narrow gaps.
Innovation Solution
A resin-sealed onboard control device configuration using a heat dissipating metal base with projecting and recessed portions to contain heat dissipating materials, allowing for efficient filling of narrow gaps and reducing stress, while using hard or soft materials to manage resin flow and ensure reliable sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a flexible heat dissipating material is used, then heat dissipation efficiency is improved, but the material flows or deforms under resin flow pressure during sealing
Solution Approach 1:
The base plate is divided into a resin receiving portion and a heat dissipating portion. The resin receiving portion acts as a barrier that receives and contains the resin flow during sealing, preventing it from reaching and deforming the heat dissipating material in the heat dissipating portion. This segmentation allows the flexible heat dissipating material to maintain its position and function while still providing effective heat dissipation.
Solution Approach 2:
The resin receiving portion serves as an intermediary structure between the resin injection system and the heat dissipating material. It intercepts the resin flow and provides a designated space for resin accumulation, thereby protecting the heat dissipating material from direct contact with the flowing resin and preventing deformation.
2Reliability
If resin sealing is applied to seal electronic components and circuit board, then reliability and protection are improved, but resin flow causes deformation and stress on components
Solution Approach 1:
The base plate is segmented into distinct functional zones: a resin receiving portion that absorbs the impact of resin flow and a heat dissipating portion that remains protected. This segmentation allows the resin to be contained in a specific area without exerting deformational stress on the electronic components and circuit board that need to remain stable and stress-free.
Solution Approach 2:
The resin receiving portion is designed in advance to receive and cushion the resin flow during the sealing process. By providing this pre-designed receptacle, the structure prevents the resin from directly impacting and deforming the components, thereby protecting them from stress and deformation while maintaining sealing reliability.
3Reliability
If resin sealing is applied, then protection and sealing are improved, but narrow gaps between components and base plate are not completely filled
Solution Approach 1:
The resin receiving portion creates a three-dimensional space designed specifically for resin flow and accumulation. This dimensional design allows the resin to flow freely and completely fill narrow gaps between components and the base plate from multiple directions, ensuring complete sealing protection that would be difficult to achieve with conventional flat sealing methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective heat dissipation, reduces stress on components, and ensures reliable resin sealing by protecting heat dissipating materials from resin flow and ensuring complete filling of narrow gaps, resulting in a cost-effective and reliable onboard control device.
Implementation Method 1
a heat dissipating material 50 for dissipating heat generated by a heat generating component (42) is disposed between the heat generating component (42) and the heat dissipating metal base (10)
Data Source
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AI summary
Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device to be mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element to the outside of a casing. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. At a position where the heat dissipating material is not provided in a space between the member and the circuit board, a portion in which the space between the member and the circuit board is narrower than a position where the heat dissipating material is provided in a space between the member and the heat generating electronic component.