Resin-Sealed Module Layout for Shielded Heat Dissipation
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Solution Overview
Problem
The existing module configuration, as described in Japanese Patent Laying-Open No. 2018-88460, suffers from insufficient heat radiation performance due to the isolation of the circuit surface of electronic components by the sealing resin, preventing effective heat conduction to the shield layer on the lower surface.
Innovation Solution
A module design that includes a substrate with a first main surface, a component mounted on this surface, a sealing resin covering the surface and component connections, a conductor pattern on the sealing resin's surface, and a metal member connected to the conductor pattern to pass through the sealing resin from an electrode drawn along the substrate's surface, enabling efficient heat conduction and radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield layer is formed on the lower surface of the sealing resin layer to shield electronic components, then electromagnetic shielding performance is improved, but heat radiation performance deteriorates because the circuit surface is isolated from the shield layer by the sealing resin
Solution Approach 1:
A heat radiation member is introduced as an intermediary between the sealing resin layer and the shield layer. This heat radiation member has a heat radiation surface that faces the circuit surface of the electronic component, and a heat conduction surface that contacts the shield layer. The intermediary structure enables heat to be conducted from the circuit surface through the heat radiation member to the shield layer, while the shielding function is maintained by the shield layer positioned behind the sealing resin.
2Object-affected harmful factors
If the circuit surface is isolated by the sealing resin from the shield layer, then electromagnetic shielding is achieved, but heat conduction to the shield layer becomes insufficient
Solution Approach 1:
The heat radiation member extends in the thickness direction of the sealing resin layer, creating a three-dimensional heat conduction path. The heat radiation surface faces the circuit surface while the heat conduction surface contacts the shield layer, utilizing the vertical dimension to establish thermal contact without compromising the electromagnetic isolation provided by the sealing resin in the same dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient heat generation from components mounted on both surfaces of the substrate to be radiated, improving the overall heat radiation performance of the module by ensuring effective heat conduction through the conductor pattern and metal member.
Implementation Method 1
heat generated in a first component can efficiently conduct to the first conductor pattern through the electrode drawn along the first main surface and further through the metal member
Data Source
AI summary
A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin that covers the first main surface and a portion of connection of the first component to at least the first main surface, a first conductor pattern arranged on a surface of the first sealing resin on a side distant from the first main surface, and a columnar conductor as a metal member connected to the first conductor pattern to pass through the first sealing resin from an electrode drawn from the first component along the first main surface.