Resin-Sealed Through Hole for Hermetic Electronic Package
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Solution Overview
Problem
The challenge is to ensure airtightness in electronic component packages, particularly in piezoelectric resonator devices, where reducing the size of through holes makes it difficult to fill with conductive pastes or metal members, leading to filling failures and poor internal package sealing.
Innovation Solution
The solution involves an electronic component package sealing member with a through hole that includes an internal electrode, an external electrode, and a through electrode, where at least one open face of the through hole is sealed with a resin material, providing stable conduction and airtightness, and using a photosensitive resin pattern for precise sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the size of through hole is reduced to shrink package size, then productivity and compactness are improved, but filling reliability deteriorates due to difficulty in filling with conductive paste or metal member
Solution Approach 1:
The invention changes the filling method from using highly viscous conductive paste or metal members to using a low-viscosity resin composition that can easily penetrate minute through holes. This parameter change in material properties enables reliable filling of reduced-size through holes while maintaining package compactness
Solution Approach 2:
The invention introduces a resin composition as an intermediary material that bridges the gap between the through hole and the conductive paste/metal member. The resin composition fills the through hole first, creating a pathway that allows subsequent introduction of conductive materials, thereby solving the filling difficulty in minute through holes
2Quantity of substance
If conductive paste is used to fill through hole, then electrical connection is achieved, but airtightness deteriorates due to filling failure in minute through holes
Solution Approach 1:
The resin composition serves as an intermediary that first fills the through hole to establish airtightness, then allows conductive paste to be introduced through the resin-filled hole. This two-stage filling process ensures both complete sealing and electrical connection, eliminating the airtightness problem associated with direct conductive paste filling
Solution Approach 2:
The invention changes the viscosity parameter of the filling material from high (conductive paste) to low (resin composition), enabling complete filling of minute through holes. This parameter change ensures the through hole is completely sealed, preventing airtightness deterioration while maintaining electrical conduction capability
Data Source
AI summary
An electronic component package sealing member that can be used as a first sealing member in an electronic component package in which an electrode of an electronic component element is hermetically sealed with the first sealing member and a second sealing member arranged so as to oppose each other, includes: a through hole that passes through a substrate of the electronic component package sealing member; an internal electrode that is formed on a face of the substrate opposing the second sealing member; an external electrode that is formed on a face of the substrate opposite the opposing face; and a through electrode that is formed on an inner side face of the through hole electrically connecting the internal electrode and the external electrode. In the electronic component package sealing member, at least one open face of the through hole is sealed with a resin material.