Resin-sealed Torque Sensor Housing with Suppression Structure
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Solution Overview
Problem
Resin-sealed electronic components face deformation or damage due to fluid pressure of molten molding resin during the sealing process, particularly when directly sealing flexible substrates with a molding resin, leading to inappropriate shape formation and wire breakage in torque sensors.
Innovation Solution
A resin-sealed electronic component design featuring a pair of pre-molded resin members forming a housing space around the electronic component main body, with a sealing member made of molding resin that covers at least a portion of each resin member, and a suppression structure that prevents molten resin from entering the housing space by aligning portions of the resin members in intersecting directions, and using injection molding to mold the sealing member while pressing the resin members' protrusions towards the housing space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flexible substrates are directly sealed with molding resin, then manufacturing cost is reduced and environmental resistance is improved, but the flexible substrates are deformed by fluid pressure of molten resin causing inappropriate shape formation and wire breakage
Solution Approach 1:
The resin housing is divided into a pair of resin members (first resin member and second resin member) that are aligned in a first direction with a housing space between them. This segmentation creates a structured sealing approach where the electronic component main body is housed in the housing space, and the suppression structure is formed by portions of the resin members aligned in a second direction intersecting the first direction.
Solution Approach 2:
The suppression structure acts as an intermediary barrier between the molten molding resin and the housing space. It suppresses the molding resin from entering the housing space by creating a barrier through the aligned portions of the resin members, thereby protecting the flexible substrates from deformation while still allowing the sealing function to be achieved.
2Reliability
If a large amount of molten molding resin enters the housing space, then complete sealing is achieved, but the flexible substrates are deformed or damaged
Solution Approach 1:
The suppression structure is designed in advance to counteract the harmful effect of molten resin entry. By aligning portions of the resin members in a second direction intersecting the first direction, the suppression structure creates a barrier that prevents the molding resin from entering the housing space, thereby protecting the flexible substrates from deformation or damage while maintaining sealing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively seals the electronic component main body while preventing deformation or damage from molten resin, ensuring accurate shape retention and reliable operation of the torque sensor.
Implementation Method 1
the portion located farther from the housing space in the second direction is pressed toward the housing space by fluid pressure of the molten molding resin during the injection molding
Data Source
AI summary
A resin-sealed electronic component includes an electronic component main body sealed with a resin housing. The resin housing includes a pair of resin members aligned in a first direction with sandwiching a housing space housing the electronic component main body, and a sealing member including a molding resin and being molded so as to cover at least a portion of each of the pair of resin members. A portion of one resin member of the pair of resin members and a portion of the other resin member are aligned in a second direction intersecting the first direction to constitute a suppression structure that suppresses the molding resin from entering the housing space.