Resin Sealing Method Using Adhesive Ring for Semiconductor Chips
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Solution Overview
Problem
The existing resin sealing methods for semiconductor chips require significant time to remove the support substrate after sealing with mold resin, and often leave adhesive material on the chip surface.
Innovation Solution
A resin sealing method using a chip holding sheet with an adhesive ring attached to a support substrate, allowing for easy removal of the support substrate by releasing the adhesive force, followed by peeling the chip holding sheet and grinding the mold resin to expose the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermally releasable tape is used to attach semiconductor chips to a support substrate for mold resin sealing, then the chips can be securely held during sealing, but the support substrate requires significant time to remove and adhesive material remains on chip surfaces
Solution Approach 1:
The invention divides the attachment system into three distinct segments: the support substrate, the chip holding sheet with adhesive ring, and the semiconductor chips. This segmentation allows the chip holding sheet to be detached from the support substrate after sealing, enabling rapid removal without affecting chip stability during the sealing process. The adhesive ring is strategically positioned only at the peripheral portion, separating the holding function from the chip contact area.
Solution Approach 2:
The invention extracts the adhesive function from the entire chip holding sheet and concentrates it only in the peripheral adhesive ring portion. This extraction allows the central area of the chip holding sheet to be easily separated from the support substrate after sealing, while the adhesive ring maintains chip stability during the sealing process. The adhesive material is taken out from under the chips and placed only at the periphery.
2Reliability
If a thermally releasable tape is used to attach semiconductor chips, then chips can be held during sealing, but adhesive material is left on the chip surface after removal
Solution Approach 1:
The invention segments the adhesive application area from the chip contact area. The adhesive ring is positioned only at the peripheral portion of the chip holding sheet, while the chip attachment area remains adhesive-free. This segmentation ensures that when the chip holding sheet is peeled off, no adhesive material is transferred to the chip surfaces, maintaining manufacturing precision.
Solution Approach 2:
The invention extracts the adhesive material from the chip contact region and places it only in the peripheral adhesive ring. This extraction prevents adhesive contamination of the chip surfaces during removal, while still providing sufficient holding stability during the sealing process through the peripheral adhesive concentration.
3Reliability
If the adhesive ring outer size equals the chip holding sheet size, then the chip holding sheet can be fully attached to the support substrate, but removal becomes more difficult
Solution Approach 1:
The invention segments the adhesive ring from the rest of the chip holding sheet by positioning it only at the peripheral portion. This segmentation creates a clear distinction between the attachment region (adhesive ring) and the separation region (central area), allowing the central area to be easily peeled off from the support substrate after sealing while maintaining attachment strength during the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces manufacturing time and improves efficiency by simplifying the separation of the mold resin and chip holding sheet from the support substrate, while minimizing adhesive residue on the chips.
Implementation Method 1
a chip holding sheet attaching step of attaching a chip holding sheet through an adhesive ring to a platelike support substrate
Implementation Method 2
the adhesive ring is formed of an ultraviolet curing adhesive, and the support substrate removing step includes the step of applying ultraviolet light to the adhesive ring to cure the adhesive ring, thereby removing the adhesive force of the adhesive ring
Data Source
AI summary
A resin sealing method for a plurality of semiconductor chips. The resin sealing method includes a chip holding sheet attaching step of attaching a chip holding sheet through an adhesive ring to a support substrate, a semiconductor chip attaching step of attaching the front side of each semiconductor chip to an adhesive layer constituting the chip holding sheet in an area corresponding to the inside of the adhesive ring, a resin sealing step of sealing all of the semiconductor chips with a mold resin, a support substrate removing step of removing the support substrate from the chip holding sheet on which the semiconductor chips are attached and sealed with the mold resin, and a chip holding sheet peeling step of peeling the chip holding sheet from the front side of each semiconductor chip sealed with the mold resin.