Resin Composition for Sealing Organic Electronic Devices

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing transparent sealing materials for organic electronic device elements, such as organic electroluminescent displays, face issues with insufficient water vapor barrier properties, adhesion force, and poor followability, leading to durability and appearance problems due to moisture and air bubble ingress.

Innovation Solution

A resin composition comprising a polyisobutylene resin, a hydrogenated cyclic olefin resin, and a rubber elastic polymer, formulated through radical, anionic, or coordination polymerization, with specific molecular weight ranges and ratios to enhance water vapor barrier, adhesion, and followability, while preventing air bubble entrainment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If existing transparent sealing materials are used, then water vapor barrier properties are provided, but adhesion force is insufficient and durability is compromised due to moisture permeation through adhesion interface

Engineering Contradiction:
Improvewater vapor barrier propertiesVSAvoidadhesion force
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent uses a composite resin composition comprising multiple components: polyisobutylene resin (provides water vapor barrier), hydrogenated cyclic olefin resin (enhances adhesion), and rubber polymer (improves followability). This composite approach allows simultaneous achievement of high water vapor barrier properties, strong adhesion force, and excellent followability, resolving the contradiction between water vapor barrier and adhesion force

Inventive Principle:
Principle #40Composite materials

2Reliability

If existing sealing materials are used, then some protection is provided, but followability is poor causing air bubbles to enter between adherend and sealing material

Engineering Contradiction:
Improvesealing protectionVSAvoidfollowability
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent modifies the chemical composition parameters of the sealing material by incorporating rubber polymer (obtained by radical, anionic, or coordination polymerization) in specific amounts (5-50 parts by mass per 100 parts of polyisobutylene resin). This parameter change enhances the followability of the sealing material, allowing it to conform to the adherend surface and prevent air bubble entrapment while maintaining sealing protection

Inventive Principle:
Principle #35Parameter changes

3Reliability

If polyisobutylene resin and hydrogenated petroleum resin are used, then water vapor barrier is achieved, but adhesion onto adherend is insufficient

Engineering Contradiction:
Improvewater vapor barrierVSAvoidadhesion onto adherend
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent introduces hydrogenated cyclic olefin resin as an intermediary component that bridges the gap between polyisobutylene resin (water vapor barrier) and the adherend surface (glass substrate). This intermediary resin enhances the adhesion interface while maintaining the water vapor barrier properties of the polyisobutylene component

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resin composition provides a robust water vapor barrier, strong adhesion, and excellent followability, significantly improving the durability and appearance of organic electronic device elements by preventing moisture and air ingress.

Implementation Method 1

a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity

Methodology Applied
Scientific EffectRubber elasticity: Elasticity

Data Source

PatentUS11139449B2Resin composition for sealing organic electronic device element, resin sheet for sealing organic electronic device element, organic electroluminescent element, and image display apparatus
Publication Date: 2021.10.05 FURUKAWA ELECTRIC CO LTD
  • US11139449B2 patent drawing
  • US11139449B2 patent drawing

AI summary

A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.