Electronic Component Module Resin Sealing Thermal Shock

Solution Overview

Problem

Existing electronic component modules often face challenges in achieving both sufficient sealing properties and thermal shock resistance, as resin films with high extensibility for improved sealing may compromise joining reliability due to low elastic coefficients.

Innovation Solution

An electronic component module design featuring a resin sealing portion with a film-shaped resin layer and an embedding resin layer, where the film-shaped resin layer covers the electronic component and substrate, and the embedding resin layer has a smaller coefficient of linear expansion, ensuring both sealing and thermal shock resistance through strategic thickness adjustments and material properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a resin film with high extensibility is used to improve sealing properties, then sealing properties are improved, but elastic coefficient becomes low and joining reliability deteriorates

Engineering Contradiction:

Improvesealing propertiesVSAvoidelastic coefficient

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The resin sealing portion is divided into two distinct layers: a film-shaped resin layer for sealing and an embedding resin layer for structural support. This segmentation allows each layer to be optimized for its specific function, resolving the contradiction between sealing properties and elastic coefficient.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention uses a composite structure combining two different resin materials with distinct properties. The film-shaped resin layer provides high extensibility for sealing, while the embedding resin layer provides high elastic coefficient for joining reliability, achieving both requirements simultaneously.

Inventive Principle:

Principle #40Composite materials

2Ease of operation

If the film-shaped resin layer is made thinner to allow easy extension, then ease of operation is improved, but sealing properties may deteriorate

Engineering Contradiction:

Improveease of extensionVSAvoidsealing properties

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The resin sealing portion is divided into two distinct layers: a film-shaped resin layer for sealing and an embedding resin layer for structural support. This segmentation allows each layer to be optimized for its specific function, resolving the contradiction between sealing properties and elastic coefficient.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention optimizes the thickness parameter of the film-shaped resin layer to balance extensibility and sealing performance. By controlling the thickness within a specific range, the resin film can extend easily during reflow while maintaining sufficient sealing properties.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If the resin film is made softer to improve close contact sealing, then sealing properties are improved, but thermal shock resistance deteriorates

Engineering Contradiction:

Improvesealing propertiesVSAvoidthermal shock resistance

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The resin sealing portion is divided into two distinct layers: a film-shaped resin layer for sealing and an embedding resin layer for structural support. This segmentation allows each layer to be optimized for its specific function, resolving the contradiction between sealing properties and elastic coefficient.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention uses a composite structure combining two different resin materials with distinct properties. The film-shaped resin layer provides high extensibility for sealing, while the embedding resin layer provides high elastic coefficient for joining reliability, achieving both requirements simultaneously.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module achieves high reliability by enhancing thermal shock resistance and sealing properties, preventing breakage and maintaining functional stability under temperature changes, while allowing for easy extension and reflow without compromising bonding.

Implementation Method 1

The embedding resin layer has a smaller coefficient of linear expansion than a coefficient of linear expansion of the film-shaped resin layer

Methodology Applied

Scientific EffectCoefficient of linear expansion: Thermal Expansion

Data Source

PatentUS9704770B2Electronic component module

Publication Date: 2017.07.11 MURATA MFG CO LTD

AI summary

An electronic component module includes a substrate, an electronic component mounted on the substrate, and a resin sealing portion that seals the electronic component and covers a principal surface of the substrate. The resin sealing portion includes a film-shaped resin layer that covers upper and side surfaces of the electronic component and the principal surface of the substrate, and an embedding resin layer that covers the film-shaped resin layer. The embedding resin layer has a smaller coefficient of linear expansion than that of the film-shaped resin layer. A portion of the film-shaped resin layer covering the side surfaces has a smaller thickness than either of a thickness of a portion of the film-shaped resin layer covering the upper surface and a thickness of a portion of the film-shaped resin layer covering the principal surface.