Substrate Storage Container Locking Mechanism with Resin Shafts
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Solution Overview
Problem
Conventional substrate storage containers using metal pins for locking mechanisms risk degrading coupling strength and causing locking members to fall off, potentially contaminating semiconductor wafers.
Innovation Solution
Replace metal pins with resin shafts of 1.5 mm or greater diameter for the locking mechanism, integrating a holder member with resin fulcrum shafts to enhance coupling strength and prevent falling, while using resin materials with improved abrasion resistance and reduced dust generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal pins are used for coupling the locking claw and connecting bar, then the coupling strength is sufficient, but the metal pins may degrade over time and cause the locking member to fall off, contaminating semiconductor wafers
Solution Approach 1:
The patent replaces metal pins with resin shafts having a diameter of 1.5 mm or more to eliminate metal contamination while maintaining coupling strength. The resin shaft is rotatably connected to the locking claw and connecting bar, providing the necessary mechanical function without the harmful effects of metal degradation and contamination.
Solution Approach 2:
The patent changes the material parameter from metal to resin and increases the diameter parameter to 1.5 mm or more. This parameter change allows the shaft to maintain sufficient coupling strength while eliminating metal contamination risks to semiconductor wafers.
2Reliability
If resin shafts with diameter of 1.5 mm or more are used, then coupling strength is maintained and falling off is prevented, but the device complexity increases
Solution Approach 1:
The patent specifies a minimum diameter of 1.5 mm for the resin shaft to ensure sufficient coupling strength and prevent falling off during repeated operations. This parameter specification maintains reliability while using simpler resin material instead of metal.
3Object-generated harmful factors
If resin materials are used for the locking mechanism, then dust generation is reduced and abrasion resistance is improved, but the initial coupling strength may be lower than metal
Solution Approach 1:
The patent increases the shaft diameter to 1.5 mm or more to compensate for the lower inherent strength of resin materials. This parameter change ensures that resin shafts achieve sufficient coupling strength while maintaining the advantages of reduced dust generation and improved abrasion resistance.
Solution Approach 2:
The patent uses resin as a composite material alternative to metal, leveraging its properties of reduced dust generation and improved abrasion resistance. The increased diameter compensates for any strength deficiencies, creating an overall superior solution for semiconductor wafer storage.
Data Source
AI summary
Provided is a substrate storage container that can eliminate lower coupling strength between a slide member and bent locking member, and bent locking member falling from the slide member without a metal pin. The container includes a lid fitted to an open front face of a container body, and locking mechanism that locks the lid. The locking mechanism includes an operating reel supported on the lid and turned by external operation, connecting bar that slides to vertical direction of the lid as the reel turns, locking claw projected from a passage opening in the periphery of the lid as the connecting bar slides and can be engaged with a locking pocket on front inner circumference of the container body. The locking claw is coupled rotatably at distal part of the connecting bar by a resin pin which can reduce generation of metal ions and eliminate adverse effects on semiconductor wafers.