Resin Sheet Wiring Board Recess Formation for Fine Laser Patterning
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Solution Overview
Problem
The existing methods for forming fine wiring layers in semiconductor devices are complex and require multiple steps, including seed layer formation, resist application, electroplating, and seed layer removal, making the process cumbersome and in need of simplification.
Innovation Solution
A method involving a resin sheet with a glass cloth in an organic resin, where a recess is formed using an excimer laser in the resin sheet's first layer region without glass cloth, allowing for fine processing and easy formation of a wiring layer, which can be achieved by either forming the recess or opening portion first, or simultaneously, with options for plating treatment or other methods, and using a high elasticity layer for enhanced processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods (sputtering, resist, electroplating) are used to form fine wiring layers, then wiring layer conductivity is achieved, but manufacturing process complexity increases
Solution Approach 1:
The patent extracts and removes the glass cloth from specific regions of the resin sheet to create glass cloth-free regions. This extraction enables direct laser processing and electroplating in those areas, eliminating the need for sputtering and resist steps while achieving fine wiring layer formation with simplified processes
Solution Approach 2:
The glass cloth removal is performed in advance before the wiring layer formation process. By preliminarily creating glass cloth-free regions, the patent enables subsequent direct laser processing and electroplating, simplifying the overall manufacturing process and reducing the number of steps required
2Strength
If glass cloth is present throughout the resin sheet, then mechanical strength is maintained, but fine processing capability is reduced
Solution Approach 1:
The patent applies local quality by creating regions with different glass cloth configurations. Specific areas have glass cloth removed to enable fine processing and laser treatment, while other regions retain glass cloth to maintain mechanical strength. This localized differentiation allows simultaneous achievement of fine processing capability and structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the formation of fine wiring layers, reduces manufacturing complexity, and enables the creation of high-conductivity wiring layers with improved yield and cost-effectiveness, particularly suitable for high-density semiconductor devices.
Implementation Method 1
forming a recess by excimer laser in a first resin layer region in which the glass cloth does not exist on a surface side of the resin sheet
Data Source
AI summary
A method for manufacturing a wiring board includes preparing a structure body in which a resin sheet having a glass cloth arranged in an organic resin is attached onto a support body having a metal layer provided on a surface thereof or onto a built-in wiring layer provided on the support body, forming a recess by excimer laser in a first resin layer region in which the glass cloth does not exist on a surface side of the resin sheet, forming an opening portion reaching the metal layer on the support body from the surface of the resin sheet, and forming a wiring layer in the recess and the opening portion.