Resin Sealing Sheet Layout for Uniform Package Thickness

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Solution Overview

Problem

The existing resin supply method for compression molding results in variations in package dimensions due to uneven resin flow, where the central portion of the sheet resin fails to flow, leading to thinner resin at the workpiece ends compared to the central area.

Innovation Solution

Forming penetrating holes or recesses in the central portion of the sheet resin to allow for inward resin flow during heating and compression, ensuring uniform thickness and reducing dimension variations in the molded resin.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the sheet resin is heated and compressed in conventional compression molding, then the resin flows to the outer edge of the cavity, but the central portion of the sheet resin is unable to flow, resulting in uneven resin thickness

Engineering Contradiction:
Improveresin thickness uniformityVSAvoidresin flow uniformity
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by creating a non-uniform resin distribution in the sheet resin through penetrating holes or recesses in the central portion. This local modification allows the central area to have different flow characteristics compared to the peripheral area, enabling the resin to flow inward toward the center while maintaining overall thickness uniformity across the workpiece.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If the sheet resin is compressed uniformly, then the manufacturing process is simple, but the resin thickness varies between central and peripheral portions

Engineering Contradiction:
Improvecompression molding simplicityVSAvoidpackage dimension consistency
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by pre-forming penetrating holes or recesses in the central portion of the sheet resin before compression molding. This preliminary modification of the resin structure enables the subsequent compression process to produce uniform thickness without requiring complex compression patterns or multiple molding steps.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces thickness variations in the molded resin and consequently minimizes variations in package dimensions by allowing the resin to fill the central holes or recesses, ensuring consistent resin distribution across the workpiece.

Implementation Method 1

the sheet resin that has been heated and compressed flows inward so as to fill the at least one penetrating hole or recess

Methodology Applied
Scientific EffectViscoelastic flow: Viscoelasticity

Data Source

PatentUS20240149504A1Resin-sealing method and resin-sealing device
Publication Date: 2024.05.09 APIC YAMADA CORP
  • US20240149504A1 patent drawing
  • US20240149504A1 patent drawing
  • US20240149504A1 patent drawing

AI summary

A resin-sealing method compression molds a resin on a workpiece having a plurality of components mounted on a carrier and manufactures a plurality of packages in each of which at least one of the components is sealed with the resin, the resin-sealing method including: setting a sheet resin in a resin molding die; and compression molding the sheet resin set in the resin molding die, wherein a penetrating hole is formed in a central portion of the sheet resin so that the amount of the resin is less in the central portion than in a peripheral portion of the sheet resin in plan view.