Resin Sheet Warpage and Irregularity Control
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Solution Overview
Problem
The use of an epoxy resin composition containing a stress relaxing material and an inorganic filler leads to irregularities and warpage during lamination and curing due to incompatibility and increased melt viscosity.
Innovation Solution
A resin sheet with a composition including epoxy resin, an organic solvent, an inorganic filler, and a stress relaxing material, where the aromatic solvent content is limited to 0-9% by mass, effectively suppressing irregularities and warpage by optimizing the resin composition's properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a stress relaxing material is blended into an epoxy resin composition containing an inorganic filler, then warpage after curing is suppressed, but irregularity after lamination occurs due to incompatibility and increased melt viscosity
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system by introducing a specific aromatic compound (content: 0.1-10 parts by mass per 100 parts of inorganic filler) to modify the interaction between the stress relaxing material and inorganic filler. This parameter change resolves the incompatibility issue while maintaining the warpage suppression effect.
Solution Approach 2:
The aromatic compound acts as an intermediary substance that facilitates compatibility between the stress relaxing material and inorganic filler. It mediates the interaction between these two components, enabling them to work together without causing irregularity during lamination while still suppressing warpage after curing.
2Reliability
If the melt viscosity of the resin composition is increased by adding inorganic filler, then dielectric loss tangent is lowered, but irregularity after lamination occurs
Solution Approach 1:
The aromatic compound serves as a mediator that enables the inorganic filler to be effectively dispersed in the epoxy resin composition. It facilitates the interaction between the inorganic filler and resin matrix, allowing high filler content (for low dielectric loss) without causing irregularity during lamination due to excessive viscosity or poor flow.
3Manufacturing precision
If aromatic solvent content is increased to improve compatibility, then irregularity after lamination is reduced, but warpage after curing increases
Solution Approach 1:
The patent precisely controls the concentration parameter of the aromatic compound within the narrow range of 0.1-10 parts by mass per 100 parts of inorganic filler. This optimized parameter setting provides sufficient compatibility to prevent irregularity during lamination while avoiding excessive aromatic content that would cause warpage after curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin sheet achieves suppressed irregularities and warpage after lamination and curing, enhancing the manufacturing process for printed wiring boards by improving the resin composition's compatibility and viscosity.
Implementation Method 1
the inorganic filler increased a melt viscosity of the composition
Data Source
AI summary
A resin sheet including a support and a resin composition layer formed on the support, in which the resin composition layer contains (A) an epoxy resin, (B) an organic solvent, (C) an inorganic filler, and (D) a stress relaxing material, in which a content of an aromatic solvent having a boiling point of lower than 120° C. in the (B) component is in the range of 0 to 9% by mass relative to 100% by mass of total of the (B) component, can suppress an irregularity after lamination and a warpage after curing.