Resin Composition with Silver-Coated Particles for Thermal Stress Mitigation
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Solution Overview
Problem
Resin compositions used in semiconductor bonding suffer from local concentration of thermal stress, leading to cracking and reduced durability and reliability due to differences in thermal expansion coefficients between materials.
Innovation Solution
A resin composition with silver-coated particles having a specific Young's modulus ratio to the binder resin, combined with a functional group to enhance adhesiveness, is used to mitigate thermal stress and ensure reliable bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin composition including binder resin and conductive particles is used for bonding semiconductor elements, then bonding can be achieved, but thermal stress concentrates locally in the adhesive layer due to coefficient of thermal expansion differences, causing cracking and reduced durability
Solution Approach 1:
The patent modifies the physical and chemical parameters of the conductive particles by introducing functional groups to their surfaces. This changes the interfacial properties between particles and binder resin, improving stress distribution. The functional groups create better adhesion and reduce local stress concentration points that would otherwise lead to cracking under thermal cycling conditions.
Solution Approach 2:
The patent creates a composite structure by combining conductive particles with functional group modifications and binder resin in specific ratios. This composite approach allows the adhesive layer to simultaneously provide electrical conductivity, mechanical bonding, and improved thermal stress resistance through the synergistic interaction of its components.
2Reliability
If conventional resin compositions are used, then manufacturing is simple, but cracking occurs in the adhesive layer due to thermal stress, reducing reliability
Solution Approach 1:
The patent introduces functional groups on the particle surfaces and optimizes the ratio of conductive particles to binder resin. These parameter changes improve adhesive layer integrity by reducing thermal stress concentration, while maintaining a manufacturing process that is still based on conventional mixing and bonding techniques.
3Strength
If the Young's modulus of conductive particles is much higher than the binder resin, then the adhesive layer becomes too rigid, but this causes local concentration of thermal stress and cracking
Solution Approach 1:
The patent introduces functional groups to the conductive particles and optimizes their ratio in the adhesive layer. This modifies the effective mechanical properties of the composite, creating a balance where the adhesive layer maintains sufficient rigidity for structural support while the functional groups and particle distribution prevent excessive stress concentration that would lead to cracking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively suppresses thermal stress concentration, preventing cracks and ensuring excellent bonding reliability even under heat cycles, thereby enhancing the durability of semiconductor devices.
Implementation Method 1
The resin composition is cured with heat and the like, and thus bonding of a member and the like can be performed by curing the resin composition after applying the resin composition to a portion to be bonded.
Implementation Method 2
thermal stress is locally concentrated at the inside of the adhesive layer due to a difference in a coefficient of thermal expansion between respective materials
Data Source
Figure 1
AI summary
A resin composition is provided, including a binder resin, and silver-coated particles in which a functional group is introduced to a surface. A ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, and the Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa.