Integral Resin Sleeve for Power Semiconductor Electrode Exposure
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Solution Overview
Problem
In transfer-molding type power semiconductor devices, achieving top-exposed electrode structures without strictly controlling the dimensions of internal components and molds is challenging, leading to issues with electrode exposure and miniaturization due to precise dimension requirements, which increases manufacturing costs and decreases yield.
Innovation Solution
A power semiconductor device with an integral resin sleeve that fits around metal electrode terminals, protecting them from mold pressure and allowing for top-exposed electrode structures without strict dimension control, achieved through a manufacturing method involving mold clamping and resin filling with the sleeve parts in contact with the mold inner walls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the total thickness from the insulating substrate to the tip of the metal electrode terminal is increased to ensure electrode exposure, then the electrode can be exposed to the outside of the molding resin, but the internal components are damaged by mold clamping
Solution Approach 1:
The invention divides the electrode terminal into multiple segments: the insulating substrate, the metal electrode terminal body, and the resin protrusion extending from the molding resin. This segmentation allows the electrode terminal to achieve the necessary total thickness for exposure while protecting the internal components from mold clamping damage, as the resin protrusion acts as a buffer that prevents direct contact between the mold and the electrode terminal during clamping.
2Strength
If the total thickness is decreased to avoid damage from mold clamping, then the component integrity is maintained, but the electrode terminal is not exposed to the outside of the molding resin
Solution Approach 1:
The invention forms the resin protrusion in advance during the molding process, before the electrode terminal needs to be exposed. The resin protrusion is created as part of the molding resin structure, and it pre-establishes the necessary thickness and exposure configuration, ensuring that the electrode terminal is properly exposed without requiring additional thickness adjustments that could compromise component integrity.
3Manufacturing precision
If strict dimension control is implemented to achieve proper electrode exposure, then the manufacturing precision is improved, but the manufacturing cost increases and yield decreases
Solution Approach 1:
The invention changes the structural parameter of the electrode terminal assembly by adding the resin protrusion element. This parameter change transforms the exposure mechanism from one that relies on precise control of the electrode terminal thickness to one that relies on the resin protrusion extending from the molding resin. This eliminates the need for strict dimension control of the internal components, thereby reducing manufacturing costs and improving yield.
4Reliability
If the metal electrode terminal is arranged perpendicular to the insulating substrate for top exposure, then the creeping distance between electrodes is increased, but the device complexity increases
Solution Approach 1:
The molding resin serves multiple functions: it seals the internal components, provides structural support, and forms the resin protrusion that enables electrode exposure. This multi-functionality eliminates the need for separate protective structures or additional components, thereby maintaining device simplicity while achieving the desired perpendicular arrangement of electrode terminals for increased creeping distance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of power semiconductor devices with top-exposed electrodes without the need for precise dimension control, reducing manufacturing costs and increasing yield while allowing for miniaturization by increasing the creeping distance between electrodes.
Implementation Method 1
a resin composition (molding resin) is melted by high-frequency heating as required
Implementation Method 2
the molding resin is heat-melted to be filled in the cavity and then is cured
Data Source
AI summary
A method of manufacturing includes arranging an integral resin sleeve formed by integrating a plurality of sleeve parts so that the sleeve parts are respectively fitted with a plurality of electrode terminals. There is a press-fitting of the sleeve parts to the electrode terminals by performing mold clamping on molds to apply a force downward on the integral resin sleeve. Further, there is a filling of a molding resin into a hollow cavity of the molds.