Resin Solution for Semiconductor Alpha Particle Protection
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Solution Overview
Problem
Conventional methods for forming a polyimide layer on semiconductor devices require high temperatures above 280°C for cross-linking, which can lead to deficiencies and reduced yield, and do not effectively protect against alpha particles that degrade the reliability of semiconductor memory devices.
Innovation Solution
A resin solution comprising an organic solvent and a resol or novolac resin, combined with a cross-linking agent, photo active compound, and development accelerator, which allows for the formation of a cured resin layer at lower temperatures (120°C to 250°C) and provides protection against alpha particles through selective exposure and development.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polyimide layer is formed using conventional methods with polyamic acid and organic solvent, then a protection layer can be formed, but the cross-linking reaction requires temperatures above 280°C which can create deficiencies in semiconductor devices and reduce yield
Solution Approach 1:
The patent changes the chemical parameters of the resin system from polyamic acid to phenolic resin (resol or novolac type), which fundamentally alters the cross-linking reaction characteristics. This parameter change enables cross-linking to occur at lower temperatures (150-250°C) while maintaining the protective function of the layer, thus resolving the contradiction between forming a reliable protection layer and avoiding high temperature damage to semiconductor devices
Solution Approach 2:
The patent employs composite material strategies by combining phenolic resin with specific organic solvents and cross-linking agents. This composite approach creates a resin solution that achieves effective cross-linking at lower temperatures, simultaneously providing the protection layer formation capability while reducing the baking temperature requirement compared to conventional polyimide systems
2Temperature
If the baking temperature is reduced to below 280°C to avoid device deficiencies, then device reliability is improved, but the cross-linking reaction of polyamic acid cannot occur effectively
Solution Approach 1:
The patent changes the chemical nature of the resin from polyamic acid to phenolic resin, which has inherently different reactivity characteristics. Phenolic resins can undergo cross-linking at lower temperatures through condensation reactions, eliminating the need for high-temperature processing while ensuring effective cross-linking occurs, thus resolving the contradiction between low temperature processing and effective cross-linking
3Reliability
If conventional polyimide layers are used to protect semiconductor devices, then some protection is provided, but they are not effective against alpha particles that penetrate and degrade device reliability
Solution Approach 1:
The patent changes the material composition from polyimide to phenolic resin, which provides superior protection against alpha particles. This material parameter change maintains ease of manufacture through similar application methods (coating and baking) while significantly improving the protective capability against alpha particle penetration, thus resolving the contradiction between enhanced protection and manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of a reliable protection layer at lower temperatures, reducing semiconductor device deficiencies and enhancing the reliability of memory devices by effectively blocking alpha particles, thus improving the yield and performance of semiconductor fabrication.
Implementation Method 1
A cross-link reaction must occur between the organic solvent and the polyamic acid to form the polyimide layer
Implementation Method 2
selective exposure and development
Data Source
AI summary
A resin solution usable for forming a protection layer, including an organic solvent and a resol resin. The resin solution may further include any combination of a cross-linking agene or agent(s), a photo active compound (PAC) or compounds(s), and/or development accelerator or accelerator(s) a method forming a cured resin layer, including applying a resin solution, including a resol resin, directly or indirectly on a substrate and hard baking the resin solution to form the cured resin layer. The resin solution may include a resol resin and/or a novolac resin.