Resin Composition Solvent Segmentation for Ink Stability
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Solution Overview
Problem
Existing inks used for non-absorbent base materials face challenges in achieving both storage stability and solvent resistance, particularly when sterilization with chemicals is required, as excessive solvent can lead to reduced storage stability and inadequate solvent resistance.
Innovation Solution
A resin composition comprising resin particles, water, a first solvent with a boiling point less than 250°C, and a second solvent with a boiling point of 250°C or more, where the relative energy difference between the second solvent and the resin is 3 or less, along with an aqueous ink and ink jet recording device that utilize this composition for improved coating performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solvent that easily dissolves resin is added to improve coating performance, then solvent resistance is improved, but storage stability deteriorates
Solution Approach 1:
The patent divides the solvent system into two distinct segments: a first solvent (boiling point <250°C) and a second solvent (boiling point ≥250°C). This segmentation allows each solvent to perform its specific function - the first solvent provides storage stability while the second solvent enables film formation and solvent resistance, resolving the contradiction between storage stability and solvent resistance.
Solution Approach 2:
The patent changes the physical parameters of the solvent system by selecting solvents with specific boiling point ranges and controlling their mass ratios. The second solvent has a boiling point of 250°C or higher and a specific HSP distance (Ra) of 3 or less from the resin, with a mass ratio to resin solid content of 0.7 to 2.3. These parameter changes enable the system to achieve both storage stability and solvent resistance simultaneously.
2Reliability
If excessive solvent is added to improve film formation, then coating performance is improved, but storage stability is reduced
Solution Approach 1:
The patent precisely controls the mass ratio of the second solvent to resin solid content within 0.7 to 2.3, and the boiling point of the second solvent at 250°C or higher. These parameter changes ensure sufficient film formation capability while preventing excessive solvent content that would compromise storage stability.
Solution Approach 2:
The patent segments the solvent functions by assigning the first solvent (lower boiling point) to maintain storage stability and the second solvent (higher boiling point) to enable film formation. This functional segmentation allows the system to achieve good coating performance without requiring excessive total solvent content.
3Reliability
If a solvent with high boiling point is used to improve solvent resistance, then film formation is improved, but drying characteristics may worsen
Solution Approach 1:
The patent segments the drying process into two stages using two solvents with different boiling points. The first solvent (boiling point <250°C) evaporates first during initial drying, providing good drying characteristics. The second solvent (boiling point ≥250°C) remains to provide solvent resistance and complete film formation, resolving the contradiction between drying characteristics and solvent resistance.
Solution Approach 2:
The patent implements periodic evaporation action where the first solvent evaporates in the initial drying stage, followed by the gradual evaporation of the second solvent during the film formation stage. This periodic action ensures both good drying characteristics and excellent solvent resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves both storage stability and solvent resistance, ensuring effective film formation and resistance to solvents, even after sterilization, by optimizing the mixing properties and drying characteristics of the solvents with the resin.
Implementation Method 1
a second solvent having a boiling point of 250° C. or more. A relative energy difference (RED), Ra/R0, in the Hansen solubility parameter (HSP) system between the second solvent and the resin is 3 or less.
Implementation Method 2
a first solvent having a boiling point of less than 250° C.; and a second solvent having a boiling point of 250° C. or more
Data Source
AI summary
A resin composition includes: resin particles including a resin; water; a first solvent having a boiling point of less than 250° C.; and a second solvent having a boiling point of 250° C. or more. A relative energy difference (RED), Ra/R0, in the Hansen solubility parameter (HSP) system between the second solvent and the resin is 3 or less. Ra is an HSP distance between the second solvent and the resin. R0 is a radius of a Hansen sphere of the resin. The Hansen sphere is determined so as to include coordinates of solvents having a boiling point of 250° C. or more in which the resin is dissolvable. A mass ratio of the second solvent to a solid component the resin particles in the resin composition is 0.7 to 2.3.