Fiber Glass Resin Spacer for Thin Chip Stacking Without Cracking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Silicon-based wafer spacers for chip packaging are fragile, costly, and limited in thickness, leading to low yield and high production costs, with existing methods consuming significant resources and prone to cracking.
Innovation Solution
A resin spacer for chip stacking and packaging is developed, using a fiber glass fabric base material with specific weight percentages of epoxy resin, quartz powder, aluminum oxide, calcium oxide, and a curing agent, along with a preparation method involving mixing, impregnating, partial curing, and pressing to create a durable and flexible spacer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon-based wafer spacers are used for chip packaging, then the spacer provides structural support and ensures even chip adhering, but the spacer becomes fragile and prone to cracking, leading to low yield and high production costs
Solution Approach 1:
The patent applies composite materials by combining fiber glass fabric with resin matrix to create a spacer that integrates the high strength and flexibility of glass fibers with the binding and protective properties of resin. This composite structure eliminates the fragility of pure silicon-based spacers while maintaining structural support functionality, directly resolving the contradiction between reliability and production yield.
Solution Approach 2:
The patent changes the material parameters from silicon-based to fiber glass fabric-reinforced resin, fundamentally altering the mechanical properties of the spacer. This parameter change transforms the spacer from a brittle material prone to cracking into a flexible, durable composite material that can withstand processing and application without fracturing, thereby improving both reliability and productivity.
2Length of moving object
If silicon-based wafer spacers are thinned to reduce packaging size, then the packaging thickness is reduced, but the spacer becomes more fragile and cracks more easily
Solution Approach 1:
The fiber glass fabric-reinforced resin composite enables the spacer to maintain high strength even at reduced thickness. The glass fiber network provides structural integrity while the resin matrix binds the fibers together, creating a thin yet strong spacer that does not sacrifice strength for reduced thickness, resolving the contradiction between length reduction and strength maintenance.
Solution Approach 2:
The patent employs a flexible thin film structure using the fiber glass fabric-reinforced resin composite. This flexible thin film can be made very thin while maintaining strength through the distributed fiber network, allowing packaging size reduction without compromising spacer strength, thus resolving the contradiction between thickness reduction and strength preservation.
3Reliability
If silicon-based wafer spacers are used, then the spacer provides electrical insulation, but the preparation process consumes large amounts of machine capacities and auxiliary materials, leading to high production costs
Solution Approach 1:
The fiber glass fabric-reinforced resin composite inherently provides electrical insulation through the insulating properties of both glass fibers and resin matrix. This eliminates the need for complex post-processing insulation treatments required for silicon-based spacers, simplifying the manufacturing process while maintaining electrical insulation reliability.
Solution Approach 2:
The resin-based spacer uses inexpensive, readily available materials (fiber glass fabric and resin) that can be processed using simple, low-cost manufacturing methods. This replaces expensive silicon-based spacers that require high-precision, high-cost fabrication equipment and processes, significantly reducing manufacturing complexity and production costs while maintaining functional reliability.
4Adaptability or versatility
If silicon-based wafer spacers are used for three-dimensional stacking, then the chip stacking is supported, but the process is limited by the maximum size of silicon-based wafers (12 inches), causing low yield
Solution Approach 1:
The fiber glass fabric-reinforced resin composite can be manufactured in large formats without the 12-inch wafer size limitation of silicon-based materials. The flexible nature of the composite allows it to be produced as large continuous sheets or custom sizes, enabling support for larger three-dimensional stacking configurations and improving production yield by eliminating wafer size constraints.
Solution Approach 2:
The flexible, adaptable nature of the fiber glass-reinforced resin spacer allows it to be configured for various stacking arrangements and sizes. Unlike rigid silicon wafers with fixed size limitations, this composite material can be dynamically adjusted and manufactured in different dimensions to match specific packaging requirements, enhancing adaptability for three-dimensional stacking while improving productivity.
Data Source
AI summary
A resin spacer for chip stacking and packaging includes a fiber glass fabric used as a base material, a weight percent of the fiber glass fabric is 10-60 wt %; and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent. The resin spacer further includes a pigment. The pigment has a weight percent of 1-3 wt %, and the pigment is preferably at least one selected from white carbon black and pearl powder. The resin spacer is formed by mixing, impregnating, partially curing, stacking and pressing the resin material. The thickness of the resin spacer is 0.07-0.13 mm.