Resin Spacer for Step-Type Stacked Chip Packaging
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Solution Overview
Problem
The existing three-dimensional stacked chip packaging structures using silicon-based wafer spacers are limited by high production costs, low yield, fragility, and inability to reduce packaging size due to the constraints of wafer size and thickness, leading to lengthy preparation processes and excessive auxiliary material consumption.
Innovation Solution
A step-type stacked chip packaging structure utilizing a resin spacer composed of a fiber glass fabric with specific weight percentages of epoxy resin, quartz powder, aluminum oxide, calcium oxide, and a curing agent, which is stacked in a stepped manner with chips and sealed with a plastic packaging material, eliminating the need for complex preparation procedures like filming and thinning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If silicon-based wafer spacers are used in three-dimensional stacked chip packaging, then the packaging structure can be formed, but the preparation process consumes large amount of machine capacities and requires complex procedures like filming and thinning
Solution Approach 1:
The invention changes the material parameter from silicon-based wafer to resin material, which fundamentally alters the preparation process requirements. The resin spacer can be directly formed through molding without requiring filming, thinning, or cutting operations, thus simplifying the preparation process while maintaining the structural function of the spacer
Solution Approach 2:
The resin spacer is designed as a disposable component that is molded and directly used, eliminating the need for complex processing equipment and procedures associated with silicon-based spacers. This approach reduces machine capacity consumption and simplifies the manufacturing process
2Reliability
If silicon-based wafer spacers are used, then the packaging structure is stable, but the spacers are very easy to crack during processing and use, causing low yield
Solution Approach 1:
The invention uses resin material with potential reinforcement components to create a composite spacer structure that combines flexibility and strength. This composite approach prevents cracking during processing and use, improving both reliability and production yield compared to brittle silicon-based spacers
Solution Approach 2:
Changing from silicon-based material to resin material fundamentally alters the mechanical properties of the spacer, making it more flexible and resistant to cracking. This material parameter change directly addresses the fragility issue and improves production yield
3Volume of moving object
If silicon-based wafer spacers are thinned to reduce packaging size, then the packaging becomes smaller, but the spacers become more fragile and cannot be thinned beyond certain limit
Solution Approach 1:
The invention changes the material parameter from silicon to resin, which allows the spacer to be made thinner while maintaining sufficient strength. The resin material's inherent flexibility and toughness enable thin spacer design without the fragility problems that limit silicon-based spacer thickness
Solution Approach 2:
The resin spacer is designed as a thin, flexible component that can bend and deform without cracking. This flexible film approach enables significant reduction in packaging size while maintaining spacer functionality and structural integrity
4Area of stationary object
If silicon-based wafer spacers are used, then the packaging structure is formed, but the maximum size is limited to 12 inches, causing low yield
Solution Approach 1:
The invention changes the material from silicon-based wafer to resin material, which is not constrained by wafer size limitations. This allows for larger area spacers to be manufactured directly through molding, improving production yield and enabling larger packaging structures
5Ease of manufacture
If silicon-based wafer spacers are used, then the packaging structure is formed, but adhesive film, grinding wheels, and cutting tools are consumed, increasing production cost
Solution Approach 1:
The resin spacer is designed as a disposable molded component that eliminates the need for auxiliary materials such as adhesive films, grinding wheels, and cutting tools. This approach reduces auxiliary material consumption and production cost while maintaining manufacturability
Solution Approach 2:
The invention extracts and eliminates the need for complex processing steps and auxiliary materials associated with silicon-based spacer preparation. By using directly molded resin spacers, the process removes unnecessary material consumption and simplifies manufacturing
Data Source
AI summary
A step-type stacked chip packaging structure based on a resin spacer that includes: a plastic packaging material, a circuit board, a resin spacer, a first chip, a second chip and an electrical connection assembly. The resin spacer, the first chip, and the second chip are stacked on the circuit board respectively. The second chip is stacked on the first chip in a stepped manner. The circuit board, the first chip and the second chip are electrically connected together through the electrical connection assembly. The resin spacer uses a fiber glass fabric as its base material, a weight percent of the fiber glass fabric is 10-60 wt %, and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent.