Resin Molded Substrate Protrusions for Capacitor Mounting
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Solution Overview
Problem
Resin molded substrates face challenges in preventing solder overflow and visual inspection of solder state when mounting capacitors, as reinforcing ribs obstruct solder flow and recessed capacitors conceal overflowed solder, requiring X-ray analysis for verification.
Innovation Solution
Incorporating protrusions on the resin molded substrate to space capacitors from the front surface, allowing visual inspection of solder presence and state without modifying the capacitor, and preventing short circuits by directing solder flow and exposing terminal roots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If reinforcing ribs are added to the resin molded substrate to obstruct solder flow, then solder overflow is prevented, but the solder flow is blocked and inspection becomes difficult
Solution Approach 1:
The substrate surface is segmented into different functional zones: a first surface for component mounting and a second surface for soldering, separated by through-holes. This segmentation allows solder to be contained on the second surface while keeping the first surface accessible for inspection, resolving the contradiction between preventing solder overflow and enabling solder state detection.
2Stability of the object's composition
If capacitors are mounted in recessed positions, then mounting stability is improved, but solder overflow becomes invisible and requires X-ray analysis
Solution Approach 1:
The inspection problem is solved by transitioning from a two-dimensional surface inspection to a three-dimensional through-hole inspection. The through-holes provide vertical access to the solder on the second surface, allowing inspection personnel to visually detect solder overflow and state without requiring X-ray analysis, while capacitors remain mounted in stable recessed positions.
3Adaptability or versatility
If through-holes are provided for lead terminal insertion, then capacitor mounting is enabled, but solder may overflow onto the front surface
Solution Approach 1:
Different regions of the substrate are given different properties: the first surface has a component mounting surface for capacitor placement, while the second surface has a soldering surface for solder application. The through-holes are specifically designed to allow lead terminals to pass through and be soldered on the second surface, while the localized structure prevents solder from overflowing onto the first surface, thus enabling capacitor mounting while preventing solder overflow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy visual inspection of solder on the substrate surface, preventing short circuits and reducing the need for X-ray analysis, while maintaining stable capacitor mounting.
Implementation Method 1
The molten solder infiltrates into the terminal through holes along the protruding lead terminals on the back surface of the substrate
Data Source
AI summary
A resin molded substrate has at least a pair of terminal through holes for allowing lead terminals of a cylindrical capacitor to be inserted through, and at least one protrusion for supporting a side of a bottom portion of the capacitor so as to space from a front surface of the substrate the side of the bottom portion of the capacitor having the lead terminals inserted through the terminal through holes. The pair of lead terminals at the bottom portion are inserted through the terminal through holes of the resin molded substrate, whereby the capacitor is mounted in an upright state with a solder, so that the protrusion spaces the side of the bottom portion from the front surface of the resin molded substrate.