Resin Substrate Cavity Plating for Ultrasonic Bonding
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Solution Overview
Problem
Component-mounting resin substrates with thermoplastic flexible substrates face challenges in bonding due to deformation and dispersion of ultrasonic vibrations, leading to bonding failures, especially when cavities are present, which reduces reliability.
Innovation Solution
Incorporating a plating layer on the cavity walls of the resin substrate, made from a material harder than the resin body, to increase stiffness and prevent deformation during ultrasonic bonding, along with conductor patterns that enhance bonding strength and reduce vibration dispersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If ultrasonic bonding is used to bond components to the thermoplastic flexible substrate, then bonding can be performed without heating the whole structure, but the flexible substrate is likely to be partially softened and easily deformed due to frictional heat, and ultrasonic vibrations disperse making bonding failure easy to occur
Solution Approach 1:
The cavity is provided locally in the mounting area where the component is to be mounted, rather than throughout the entire substrate. This localized cavity structure allows ultrasonic vibrations to be concentrated at the bonding interface while preventing widespread dispersion, thereby improving bonding reliability without requiring temperature control across the whole substrate
Solution Approach 2:
The cavity acts as an intermediary structure that mediates between the ultrasonic bonding process and the flexible substrate. By providing a confined space in the mounting area, the cavity prevents ultrasonic vibrations from dispersing into the flexible substrate, thereby preventing bonding failure while allowing the substrate to remain flexible
2Adaptability or versatility
If a cavity is formed in the mounting area of the flexible substrate for functional reasons, then the substrate can provide required functionality, but ultrasonic vibrations are more likely to disperse making bonding failure more likely and reducing reliability
Solution Approach 1:
The cavity is localized to the mounting area where it provides functional benefits, while the rest of the substrate maintains its structural integrity for reliable bonding. This local quality approach allows the substrate to be both functionally adaptable and reliably bondable
Solution Approach 2:
The substrate combines the flexible thermoplastic material with a localized cavity structure, creating a composite system that exhibits both flexibility for functional adaptability and structural rigidity in the bonding area for reliable component attachment
3Adaptability or versatility
If the flexible substrate is made from thermoplastic material to provide flexibility, then the substrate can be bent and adapted, but the substrate is likely to be deformed when components are bonded by ultrasonic bonding due to frictional heat
Solution Approach 1:
The substrate exhibits different properties in different areas: the mounting area contains a cavity that provides structural support to prevent deformation during bonding, while other areas remain flexible. This local quality differentiation allows the substrate to be both adaptable and shape-stable
Solution Approach 2:
The substrate is effectively segmented into functional zones: the cavity-containing mounting area that provides structural stability during bonding, and the surrounding flexible areas that provide adaptability. This segmentation allows simultaneous achievement of flexibility and shape stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The plating layer and conductor patterns significantly enhance bonding reliability by preventing substrate deformation and ultrasonic wave dispersion, ensuring secure attachment of electronic components even on thermoplastic substrates with cavities.
Implementation Method 1
the plating layer increases the stiffness of the cavity
Implementation Method 2
In the case of using ultrasonic bonding, ultrasonic vibrations disperse due to the flexibility of the flexible substrate
Implementation Method 3
the flexible substrate is likely to be partially softened and easily deformed due to frictional heat
Data Source
AI summary
A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is mounted on the resin substrate by ultrasonic bonding. In a mounting area of the resin body in which the component is mounted, a cavity that is hollowed from a mounting surface on which the component is mounted is defined. A plating layer that includes a material harder than the resin body is disposed on at least a portion of a wall surface of the cavity.