Component-Embedded Resin Substrate Gap Filling
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Solution Overview
Problem
In component-embedded resin substrates, the gaps around embedded components are often not sufficiently filled during the press-bonding process, leading to unreliable connections between the embedded components and the resin layer, especially when multiple components are embedded, resulting in potential resin flow shortages and increased risk of resin peel-off.
Innovation Solution
The solution involves arranging embedded components in a manner where a first component with a smaller projected area is positioned closer to the end surface and a second component with a larger projected area is positioned farther away, ensuring that the resin flow effectively fills the gaps and enhances the reliability of the connection between the embedded components and the resin layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the recess portion is provided with a sufficient size larger than the embedded component to reliably arrange the component, then the embedded component can be properly positioned, but a gap is created around the embedded component that may not be sufficiently filled with resin
Solution Approach 1:
The patent applies local quality by creating protrusions at specific locations on the inner surface of the recess portion. These protrusions are strategically positioned to guide and restrict the embedded component, ensuring that the gap around the component is optimally positioned for resin filling. The protrusions provide localized structural features that enhance both component arrangement reliability and gap filling effectiveness.
Solution Approach 2:
The patent implements preliminary action by pre-forming protrusions on the inner surface of the recess portion before embedding the component. These protrusions are prepared in advance to control the positioning of the embedded component, ensuring that when the component is placed, the resulting gap is optimally configured for subsequent resin infiltration during press-bonding.
2Adaptability or versatility
If multiple embedded components are arranged in the resin substrate, then the functionality and integration of the substrate is enhanced, but the amount of resin available to fill gaps around each component becomes insufficient
Solution Approach 1:
The patent applies local quality by providing protrusions at specific locations on the inner surface of the recess portion. These protrusions are strategically positioned to guide and restrict the embedded component, ensuring that the gap around the component is optimally positioned for resin filling. The protrusions provide localized structural features that enhance both component arrangement reliability and gap filling effectiveness.
Solution Approach 2:
The patent implements preliminary action by pre-forming protrusions on the inner surface of the recess portion before embedding the component. These protrusions are prepared in advance to control the positioning of the embedded component, ensuring that when the component is placed, the resulting gap is optimally configured for subsequent resin infiltration during press-bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement ensures that the gaps around the embedded components are adequately filled during the press-bonding step, improving the reliability of the connection and reducing the likelihood of resin peel-off, thereby enhancing the overall performance of the component-embedded resin substrate.
Implementation Method 1
By performing the step of applying pressure to the stack while the stack is heated, that is, the press-bonding step, a phenomenon called 'resin flow' or 'resin flux' takes place in the stack, which means that a resin which is a material for a resin sheet deforms under the influence of externally applied pressure and it flows in the inside of the stack.
Data Source
AI summary
A component-embedded resin substrate includes a plurality of embedded components arranged as embedded in a resin structure. The plurality of embedded components include a first embedded component and a second embedded component. When viewed in a direction of the lamination, a first distance from the first embedded component to the closest end surface is shorter than a second distance from the second embedded component to the closest end surface. A first projection area calculated by multiplying a length along the end surface when the first embedded component is projected on the closest end surface to the first embedded component by a thickness of the first embedded component is smaller than a second projection area calculated by multiplying a length along the end surface when the second embedded component is projected on the closest end surface to the second embedded component by a thickness of the second embedded component.