Resin Substrate Through-Hole Laser Timing to Prevent Thermal Damage
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Solution Overview
Problem
Conventional methods for forming through holes in resin substrates using laser processing often result in thermal damages such as burning and digging, especially when high-output laser light is applied at high speeds, and struggle to maintain processing quality.
Innovation Solution
A manufacturing method and apparatus that use pulsed laser light to form through holes in resin substrates with a metal layer covering at least one surface, where the interval of laser irradiation is set to 5 msec or more between each point on the predetermined outer edge line, effectively dissipating thermal energy and preventing thermal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-output laser light is applied at high scanning speeds to increase productivity, then processing speed is improved, but thermal damages such as burning and digging occur
Solution Approach 1:
The patent applies periodic pulsed laser irradiation instead of continuous laser application. By controlling the pulse interval to be 5 msec or more, the laser energy is delivered in periodic bursts that allow thermal diffusion between pulses, preventing excessive heat accumulation that causes burning and digging while maintaining high processing speed
Solution Approach 2:
The patent changes the temporal parameters of laser irradiation by setting the pulse interval to 5 msec or more. This parameter adjustment allows sufficient time for heat diffusion between pulses, resolving the contradiction between high processing speed and thermal damage prevention
2Manufacturing precision
If pulsed laser light with interval of 5 msec or more is used to prevent thermal damage, then processing quality is improved, but processing time increases
Solution Approach 1:
By using periodic pulsed laser irradiation with intervals of 5 msec or more, the patent achieves both high processing quality and efficient processing time. The periodic pulses with appropriate interval prevent thermal damage while maintaining reasonable processing speed
Solution Approach 2:
The patent maintains continuous useful action by efficiently utilizing the pulse intervals for heat diffusion while keeping the overall processing continuous through multiple rounds of scanning along the outer edge line, thereby preventing thermal damage without excessive processing time extension
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for the speedy formation of through holes in resin substrates without reducing processing quality, even with high-output laser light and high scanning speeds, while preventing thermal damages like burning and digging, and can be used with substrates containing reinforcements like glass fibers without melting them.
Implementation Method 1
forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light
Implementation Method 2
an interval of irradiation at each point on the predetermined outer edge line between each round is 5 msec or more, effectively dissipating thermal energy and preventing thermal damage
Data Source
AI summary
A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.