Resin Substrate Metal Layer Transfer for Fine Patterns

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Solution Overview

Problem

The existing subtractive method for forming metal wires on substrates results in resource wastage and inaccuracies in forming submicrometer fine patterns, due to the removal of photoresist and partial metal layer removal.

Innovation Solution

A method involving a resin substrate with a metal layer formed in a hole, where a release layer is used to transfer the metal layer from a support substrate to the resin substrate, allowing for precise formation of metal patterns with dimensions of 40 nanometers to 1 micrometer in width and 20 nanometers to 120 nanometers in depth.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If the subtractive method is used to form metal layers, then the metal layer can be formed on the substrate, but resources and materials are wasted due to removal of photoresist and partial removal of the metal layer

Engineering Contradiction:

Improvematerial wasteVSAvoidmanufacturing process

Core Design Contradiction:

Loss of substanceVSEase of manufacture

Solution Approach 1:

The patent inverts the conventional subtractive approach by using an additive method where metal layers are formed only in desired pattern areas through electroless plating, eliminating the need for photoresist removal and partial metal layer removal. This reverses the manufacturing philosophy from removing material to selectively depositing material.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent changes the manufacturing parameters by transitioning from a subtractive process (etching) to an additive process (electroless plating). This parameter change enables precise control over metal layer formation, reducing material waste while maintaining manufacturing feasibility.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If the subtractive method is used to form metal layers, then the metal layer can be formed on the substrate, but it is difficult to accurately form a metal layer with a submicrometer fine pattern

Engineering Contradiction:

Improvepattern precisionVSAvoidmanufacturing process

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies preliminary action by forming a catalyst pattern on the substrate before metal deposition. This catalyst pattern serves as a pre-prepared template that guides the electroless plating process, enabling accurate formation of submicrometer fine patterns without requiring complex photoresist processing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces the mechanical/photochemical system (photoresist application and etching) with a chemical deposition system (electroless plating). This substitution enables better control over pattern formation at submicrometer scales by relying on chemical catalysis rather than mechanical removal processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Area of stationary object

If metal layers are formed using conventional methods, then the metal wiring can be created, but the surface area is limited and heat sink effect is reduced

Engineering Contradiction:

Improvesurface areaVSAvoidheat dissipation

Core Design Contradiction:

Area of stationary objectVSTemperature

Solution Approach 1:

The patent transitions from two-dimensional surface metal layers to three-dimensional filled hole structures. By forming holes in the resin substrate and filling them with metal layers, the available surface area and volume for heat dissipation are significantly increased, enhancing the heat sink effect.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent utilizes a porous structure by forming holes within the resin substrate that are then filled with metal. This creates a three-dimensional metal network that increases the effective surface area for heat exchange while maintaining a compact form factor, improving thermal management capabilities.

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the accurate formation of metal layers with fine patterns, reduces material waste, and enhances the substrate's resistance to scratches and heat sink effect by increasing the surface area.

Implementation Method 1

removing the metal layer from the first support substrate by decomposing the release layer to transfer the metal layer to the resin substrate

Methodology Applied

Scientific EffectDecomposition: Decomposition (biological)

Data Source

PatentUS7597813B2Element substrate and method of manufacturing the same

Publication Date: 2009.10.06 SEIKO EPSON CORP

AI summary

A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; disposing a second support substrate on the first support substrate so that the metal layer is interposed between the first and second support substrates; pouring a resin material in a fluid state between the first and second support substrates; curing the resin material to form a resin substrate; and removing the metal layer from the first support substrate by decomposing the release layer to transfer the metal layer to the resin substrate.