Curable Resin Receiving Substrate for Tilt-Free Microstructure Transfer
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Solution Overview
Problem
Existing methods for transferring microstructures such as mini-LEDs and micro-LEDs face issues with non-uniform mounting posture, tilting, damage during laser lift-off, and compositional changes due to cleaning, leading to microstructure falling off and displacement.
Innovation Solution
A receiving substrate with a curable resin layer on its surface, which undergoes multiple curing stages to embed and securely hold microstructures, preventing damage and controlling tilt during transfer and cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If adhesive resin is used as a donor substrate or stamp material for transfer, then microstructures can be transferred, but the microstructures often have non-uniform mounting posture and tilt relative to the plate plane
Solution Approach 1:
The patent changes the physical state parameter of the resin layer from fully cured (rigid) to partially cured (semi-solid/B-stage), which allows the resin to conform to the microstructure shape and provide uniform mounting posture while maintaining ease of transfer operation
Solution Approach 2:
The patent introduces a receiving substrate with a resin layer as an intermediary between the donor substrate and the final mounting position. This intermediary receives the microstructure in a controlled manner, ensuring uniform mounting posture during the transfer process
2Productivity
If laser lift-off is used to transfer microstructures, then transfer efficiency is improved, but local stress is applied to the microstructure causing damage
Solution Approach 1:
The patent applies beforehand cushioning by using a partially cured resin layer that acts as a stress-absorbing medium during laser lift-off. The semi-solid resin cushions the local stress that would otherwise damage the microstructure, while still allowing efficient transfer
3Manufacturing precision
If hydrochloric acid aqueous solution is used to remove Ga from the microstructure surface, then cleaning is effective, but the solder component dissolves causing compositional change and melting point increase
Solution Approach 1:
The patent introduces the receiving substrate with resin layer as an intermediary that holds the microstructure firmly during cleaning. This secure holding allows effective cleaning to remove Ga while preventing the harmful side effect of solder dissolution through proper process control
Solution Approach 2:
The patent applies preliminary anti-action by firmly holding the microstructure on the receiving substrate before cleaning, which prevents the microstructure from moving or tilting during the cleaning process that would otherwise cause solder component dissolution
4Productivity
If the microstructure is held on the donor plate, then transfer is enabled, but the microstructure falls off due to impact during cleaning
Solution Approach 1:
The patent segments the holding function from the donor plate to a dedicated receiving substrate with resin layer. This segmentation allows the receiving substrate to provide specialized holding characteristics that prevent microstructure fall-off during cleaning while maintaining transfer capability
Solution Approach 2:
The patent changes the holding mechanism parameter from mechanical adhesion on a rigid donor plate to chemical/physical adhesion in a partially cured resin layer, which provides better retention and prevents microstructure fall-off during subsequent cleaning operations
5Device complexity
If the microstructure is transferred without a receiving substrate, then the process is simple, but displacement and tilt of the microstructure occur
Solution Approach 1:
The patent introduces a receiving substrate with resin layer as an intermediary that provides a controlled environment for microstructure transfer. This intermediary enables precise position control and prevents displacement and tilt while adding minimal complexity to the overall process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin layer effectively prevents damage, displacement, and tilt of microstructures during laser lift-off and cleaning, ensuring high transfer rates and maintaining structural integrity.
Implementation Method 1
the curable resin layer is a photo-curable or thermosetting resin layer
Implementation Method 2
the curable resin layer is a photo-curable or thermosetting resin layer
Implementation Method 3
transferred by laser lift-off
Data Source
Figure 1~3
Figure 4(A)~4(E)
Figure 5(A)~8(B)
AI summary
The present invention is a receiving substrate for receiving a microstructure formed on a supply substrate and transferred by laser lift-off, wherein the receiving substrate includes a curable resin layer on a face to which the microstructure is to be transferred. Thus, the present invention can provide a receiving substrate that is capable of receiving a microstructure while suppressing damage, and also holding the microstructure while controlling displacement and a tilt thereof.