Multi-layer resin substrate flatness via local paint compensation
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Solution Overview
Problem
Existing multi-layer resin substrates suffer from noticeable projections and recesses on the outermost surface due to thickness differences caused by local patterns, leading to poor flatness and potential defects in surface mounting and connection with ICs or motherboards.
Innovation Solution
A multi-layer resin substrate is manufactured by applying a thermoplastic resin paint to regions insufficient in thickness during the stacking and thermocompression bonding process, ensuring uniform thickness and flatness across the outermost surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cushion materials are interposed between the stack and pressing plates to perform thermocompression bonding, then adhesion between layers is improved and pattern displacement is prevented, but projections and recesses become noticeable on the outermost surface, degrading flatness
Solution Approach 1:
The invention applies local quality by selectively forming paint layers only in regions where thickness compensation is needed. The paint layer is applied to specific areas of the resin layer corresponding to regions insufficient in thickness, rather than uniformly across the entire surface. This localized approach compensates for thickness variations while maintaining the functional benefits of cushion materials during pressing.
Solution Approach 2:
The invention employs preliminary action by forming the paint layer on the resin layer before thermocompression bonding. This preliminary thickness compensation ensures that when the pressing process occurs, the outermost surface achieves the desired flatness from the outset, preventing the formation of noticeable projections and recesses.
2Adaptability or versatility
If multiple resin layers with conductor patterns are stacked to form a multi-layer substrate, then functional requirements are met, but thickness differences caused by local patterns create height differences on the outermost surface
Solution Approach 1:
The paint layer is selectively formed only in regions where thickness compensation is required, corresponding to areas insufficient in thickness in the stack. This localized application maintains the functional conductor patterns while compensating for thickness variations in specific regions, achieving flatness without affecting the multi-layer functionality.
Solution Approach 2:
The invention creates a composite structure by combining the resin layer with a paint layer. This composite approach allows the paint layer to serve as a thickness-compensating element while the resin layer maintains its structural and functional properties, including the conductor patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The application of thermoplastic resin paint compensates for thickness variations, resulting in a flat outermost surface, enhancing the substrate's flatness and preventing defects in surface mounting and interconnections.
Implementation Method 1
stacking and thermocompression bonding a plurality of resin layers each composed of a thermoplastic resin as a main material
Data Source
AI summary
A multi-layer resin substrate is a multi-layer resin substrate integrated by stacking and thermocompression bonding a plurality of resin layers each composed of a thermoplastic resin as a main material and having a main surface. The plurality of resin layers include a resin layer having a pattern member arranged on the main surface. A surface of at least some resin layers of the plurality of resin layers has a paint layer, which is obtained by applying a thermoplastic resin paint to a region corresponding to a region insufficient in thickness as a stack as a whole during a process for stacking and thermocompression bonding the plurality of resin layers. The pattern member is provided, for example, by a conductor pattern.