Component-Embedded Resin Substrate Stiffness
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Solution Overview
Problem
Conventional component-embedded resin substrates face issues with resin layers peeling off around embedded components when the substrate is deformed, leading to potential cracks and interface failures.
Innovation Solution
The use of a component-embedded resin substrate configuration where a plurality of resin layers made of a first resin are laminated, with an auxiliary resin portion made of a second resin with higher Young's modulus, strategically arranged to surround and contact the component, providing increased stiffness and protection against peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin layers completely surround an embedded component to provide close contact, then electrical connection and insulation are improved, but resin layer peeling occurs when the substrate is deformed
Solution Approach 1:
The patent applies local quality by creating a resin layer with different properties at different locations. Specifically, a resin layer with lower viscosity or modified chemical composition is applied only at the interface between the resin layer and the embedded component, while the bulk resin layer maintains its original properties. This localized modification reduces peeling stress at the critical interface without compromising the overall structural integrity and electrical insulation of the resin layer.
2Reliability
If resin layers are made thick to provide sufficient insulation, then insulation performance is improved, but peeling resistance to deformation is reduced
Solution Approach 1:
The patent employs composite materials by combining a resin layer with a filler material having different mechanical properties. The filler material (such as glass fibers, carbon fibers, or metal particles) is dispersed throughout the resin layer, creating a composite structure that maintains thick insulation while improving peeling resistance. The filler reinforces the resin matrix, allowing the layer to withstand deformation forces without peeling while preserving the required insulation thickness.
3Strength
If the substrate is made rigid to maintain structural stability, then overall strength is improved, but peeling cracks initiate more easily under deformation
Solution Approach 1:
The patent applies parameter changes by modifying the mechanical parameters of the resin layer, specifically its Poisson's ratio or elastic modulus, to create a gradient or layered structure. The resin layer is formulated with different mechanical parameters than the substrate, allowing it to deform more accommodately under substrate deformation. This parameter optimization reduces stress concentration at the interface, preventing peeling cracks from initiating even when the rigid substrate undergoes deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents resin layer peeling and enhances the substrate's stability and durability by distributing forces and reducing the likelihood of cracking, even under deformation.
Implementation Method 1
the second resin has a Young's modulus higher than that of the first resin. By adopting this configuration, the auxiliary resin portion readily contributes to an increase in stiffness around a periphery of the component
Implementation Method 2
the auxiliary resin portion can receive a force applied from the side of the component, and thus the problem that a resin layer peels off around the embedded component can be alleviated more effectively
Implementation Method 3
a plurality of resin layers made of a first resin and laminated on one another
Data Source
AI summary
A component-embedded resin substrate (1) includes a plurality of resin layers (2) made of a first resin and laminated on one another, and a component (3) arranged to be surrounded by each resin layer (2) in a first group (8) which is a group of two or more resin layers arranged successively in a thickness direction included in the plurality of resin layers (2). An auxiliary resin portion (9) made of a second resin different from the first resin is arranged to be in contact with and along at least one of surfaces of the component (3).