Resin Underlayer Film for Imprint Pattern Precision

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Solution Overview

Problem

In imprint technology, there is a challenge with adhesiveness between the base material and the photocurable composition, leading to variations in the thickness distribution of residual film layers and line width distributions after processing, which affects the precision of pattern formation.

Innovation Solution

A resin composition for underlayer film formation is developed, incorporating a first resin with radical reactive groups and a second resin containing fluorine or silicon atoms, which improves adhesiveness and reduces variations in thickness distribution by enhancing fluidity and water/oil repellency, thereby stabilizing the line width distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a photocurable composition is applied directly onto a base material for imprint patterning, then the process is simple, but the adhesiveness between the base material and the photocurable composition is insufficient, leading to large variations in residual film thickness and line width distribution

Engineering Contradiction:
Improveprecision of pattern formationVSAvoidcomplexity of resin composition
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

An underlayer film is introduced as an intermediary between the base material and the photocurable composition. This underlayer film serves as a mediator that enhances adhesiveness and enables precise pattern transfer, resolving the contradiction by adding a functional intermediate layer rather than directly applying the photocurable composition to the base material.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The resin composition uses a composite structure consisting of multiple resins with different functions: a first resin (acrylic or vinyl) providing adhesion and film formation, and a second resin (polyester or polyacrylate) controlling fluidity and underlayer properties. This composite material approach allows simultaneous optimization of adhesiveness and pattern precision.

Inventive Principle:
Principle #40Composite materials

2Strength

If the resin composition is designed to enhance adhesiveness with high polymer content, then the bond strength increases, but the fluidity decreases leading to poor film formation and large thickness variations

Engineering Contradiction:
Improveadhesiveness between underlayer and photocurable compositionVSAvoiduniformity of residual film thickness
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The molecular weight of the resins is optimized to balance adhesion and fluidity. The first resin has molecular weight Mn of 5,000-50,000 and the second resin has Mn of 1,000-100,000, providing sufficient adhesion while maintaining adequate fluidity for uniform film formation, resolving the contradiction through parameter optimization.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The composite resin system combines a higher molecular weight first resin for adhesion with a lower molecular weight second resin for fluidity. This composite approach allows the system to exhibit both strong adhesion and good flow properties simultaneously, resolving the contradiction between strength and fluidity.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resin composition ensures a uniform underlayer film with reduced residual film thickness variation, improving the precision of pattern formation and adhesiveness, leading to consistent line width distribution after processing.

Implementation Method 1

a first resin having a radical reactive group in a side chain

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS10246605B2Resin composition for underlayer film formation, layered product, method for forming pattern, imprint forming kit, and process for producing device
Publication Date: 2019.04.02 FUJIFILM CORP
  • US10246605B2 patent drawing
  • US10246605B2 patent drawing
  • US10246605B2 patent drawing

AI summary

Provided are a resin composition for underlayer film formation with which a variation hardly occurs in the line width distribution after processing due to a small thickness of a residual film after mold pressing, a layered product, a method for forming a pattern, an imprint forming kit, and a process for producing a device.Disclosed is a resin composition for underlayer film formation which is used to form an underlayer film by being applied onto a base material, including a first resin having a radical reactive group in the side chain, a second resin containing at least one selected from a fluorine atom and a silicon atom, and a solvent. The second resin is preferably a resin containing a fluorine atom. The radical reactive group of the first resin is preferably a (meth)acryloyl group.