Resin Radio Wave Absorber With Tapered Protrusions for Easier Assembly
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Solution Overview
Problem
Conventional radio wave absorbers for high-frequency communication devices require metal or metallic plating, leading to issues with mass productivity, costs, and weight reduction, and have poor installation workability due to separate side walls and base plates that need screwing.
Innovation Solution
A radio wave absorber with protruding parts tapered towards semiconductor elements, integrally molded of synthetic resin, which improves absorption characteristics and simplifies installation by using an engaging part for mounting the base part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal or metallic plating is used for protrusions in radio wave absorbers, then absorption performance is achieved, but mass productivity decreases, costs increase, and weight increases
Solution Approach 1:
The patent replaces expensive metallic protrusions with inexpensive synthetic resin protrusions that are molded directly into the radio wave absorber housing. This substitution maintains the necessary absorption performance while dramatically improving mass productivity and reducing costs, as the resin protrusions can be formed in a single molding process without requiring separate metal components or plating operations.
Solution Approach 2:
The patent employs composite materials by incorporating ferrite particles or carbonyl iron particles into the synthetic resin matrix of the protrusions. This composite structure enables the resin protrusions to achieve radio wave absorption characteristics comparable to metallic protrusions, while benefiting from the manufacturing advantages of resin molding including improved productivity, reduced cost, and weight reduction.
2Strength
If side walls and base plate are formed separately and assembled with screws, then structural integrity is achieved, but installation workability deteriorates
Solution Approach 1:
The patent merges the side walls and base plate into a single integrally molded radio wave absorber housing made of synthetic resin. This unification eliminates the need for separate assembly operations and screw fastening, dramatically improving installation workability. The integral structure maintains sufficient structural integrity for the application while enabling rapid installation as a single component.
Solution Approach 2:
The integrally molded housing serves multiple functions simultaneously: it provides the structural enclosure, acts as the radio wave absorber housing, and incorporates the mounting features for securing the semiconductor element. This multi-functionality reduces the number of separate components needed and simplifies the overall assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances mass productivity, reduces costs, achieves weight reduction, and maintains absorption performance comparable to metallic protrusions while avoiding oxidation effects and simplifying assembly.
Implementation Method 1
a radio wave absorber for a high-frequency communication apparatus absorbing unwanted radiated radio waves of a millimeter wave radar or the like to reduce radio wave interference with a semiconductor element inside the high-frequency communication apparatus
Data Source
AI summary
Provided is a radio wave absorber for a high-frequency communication apparatus that can improve mass productivity, reduce costs, and further achieve weight reduction. For this purpose, a radio wave absorber includes a side part surrounding a semiconductor element fixed to a base part provided in a high-frequency communication apparatus and a top part closing an open face surrounded by the side part. An inner face of the top part is provided with a plurality of protruding parts protruding toward the semiconductor element positioned inside the radio wave absorber, positioned spaced apart from the semiconductor element, and periodically arranged. The protruding parts are formed to be tapered toward the semiconductor element and are integrally molded of a synthetic resin.