Resist Composition Acid Diffusion Control for Fine Patterns
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Solution Overview
Problem
Current resist compositions face challenges in achieving high sensitivity and excellent lithography characteristics, particularly in forming fine patterns with dimensions less than 100 nm, while maintaining defect-free results.
Innovation Solution
A resist composition that includes a base material component with a polymeric compound having specific constitutional units, an acid generator component, and an acid diffusion-controlling agent, which generates acid upon exposure and changes solubility in a developing solution, allowing for precise pattern formation through selective exposure and development.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a chemically amplified resist composition is used to improve sensitivity and resolution, then lithography characteristics are enhanced, but difficulty in achieving both high sensitivity and defect-free patterns arises
Solution Approach 1:
The patent modifies the chemical parameters of the resist composition by introducing a specific acid diffusion-controlling agent with controlled molecular weight and functional groups. This agent regulates acid diffusion distance and intensity during exposure, enabling precise control over the chemical amplification process. The parameter changes in acid diffusion characteristics allow simultaneous achievement of high sensitivity and defect-free fine pattern formation
Solution Approach 2:
The patent creates a composite resist system combining the base material component, acid generator component, and acid diffusion-controlling agent component in specific proportions. This composite formulation synergistically integrates multiple functional components to achieve both high sensitivity and excellent lithography characteristics, resolving the contradiction between sensitivity and defect-free pattern formation
2Measurement precision
If pattern fining is achieved by shortening wavelength and increasing energy, then resolution is improved, but manufacturing fine patterns with dimensions less than 100 nm becomes difficult
Solution Approach 1:
The acid diffusion-controlling agent serves as an intermediary substance that mediates between the acid generator and the base material component. It controls the diffusion and distribution of generated acid, enabling precise pattern formation at sub-100 nm dimensions. This intermediary regulates the chemical reaction zones to achieve the required manufacturing precision for fine patterns
3Productivity
If high sensitivity is pursued in resist composition, then exposure efficiency is improved, but lithography characteristics in terms of defects deteriorate
Solution Approach 1:
The acid diffusion-controlling agent provides feedback control over the acid diffusion process during exposure. By regulating acid distribution and concentration gradients, it creates a self-adjusting mechanism that maintains optimal reaction conditions. This feedback control enables high exposure efficiency while preventing defect formation through controlled chemical amplification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition achieves high sensitivity and excellent lithography characteristics, enabling the formation of fine patterns with reduced defects and improved resolution, suitable for advanced semiconductor and display element manufacturing.
Implementation Method 1
an acid generator component (B) that generates acid upon exposure
Implementation Method 2
a base material component (A) that exhibits changed solubility in a developing solution under action of acid
Implementation Method 3
an acid diffusion-controlling agent component (D)
Data Source
AI summary
A resist composition that generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid. The resist composition contains a polymeric compound having a constitutional unit (a0) represented by General Formula (a0-1), a compound (B1) represented by General Formula (b1), and a compound (D1) represented by General Formula (d1). In the formulas, R represents a hydrogen atom; Va01 represents a divalent linking group; naoi represents an integer of 1 or 2; Ra01 represents a lactone-containing cyclic group having a cyano group; Yb01 represents a divalent linking group or a single bond; Lb01 represents —C(═O)—O—; Rb01 to Rb03 represent an alkyl group; Rb04 to Rb06 represent an alkyl group; nb04 represents an integer of 0 to 4; nb05 and nb06 represent an integer of 0 to 5; X− represents a counter anion; Rd01 represents a cyclic group; and Mm+ represents an m-valent organic cation