Resist Composition with Acid Diffusion Control for Fine Pattern CDU
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Solution Overview
Problem
Existing resist compositions with bulky acid diffusion controlling agents achieve improved acid diffusion uniformity but compromise compatibility with developing solutions, leading to suboptimal critical dimension uniformity (CDU) and resolution in fine pattern formation.
Innovation Solution
A resist composition containing a base material component, an acid generator component, and an acid diffusion controlling agent with a specific compound that generates acid upon exposure, featuring a condensed cyclic group with an acid decomposable group to form a polar group, enhancing solubility changes in developing solutions for improved CDU and resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an acid diffusion controlling agent with a bulky structure and enhanced hydrophobicity is used, then acid diffusion uniformity is improved, but compatibility with developing solution decreases
Solution Approach 1:
The patent applies local quality by introducing a polar group at a specific location within the acid diffusion controlling agent molecule. The bulky structure with enhanced hydrophobicity is maintained in the main body of the molecule, while a polar group (such as carboxylic acid, hydroxyl, or ether group) is positioned at a localized site. This localized polar characteristic improves compatibility with the developing solution without compromising the overall hydrophobic bulk structure that ensures acid diffusion uniformity.
Solution Approach 2:
The patent employs composite material principles by creating an acid diffusion controlling agent that combines both hydrophobic and polar characteristics within a single molecular structure. The molecule comprises a bulky hydrophobic framework (such as bicyclooctane skeleton) combined with polar functional groups. This composite structure allows the agent to simultaneously achieve good acid diffusion uniformity through its hydrophobic bulk and maintain compatibility with developing solution through its polar components.
2Manufacturing precision
If the resist pattern size is reduced to several tens of nanometers, then lithography resolution is improved, but critical dimension uniformity becomes more difficult to maintain
Solution Approach 1:
The patent applies parameter changes by modifying the chemical parameters of the acid diffusion controlling agent. Specifically, the agent's pKa value is controlled within a specific range (3.0-6.0), and its molecular structure parameters are optimized to balance hydrophobicity and polarity. These parameter adjustments ensure that acid diffusion remains uniform even at the reduced scale of several tens of nanometers, thereby maintaining critical dimension uniformity while achieving high resolution.
3Productivity
If a compound with high hydrophobicity is used as acid diffusion controlling agent, then sensitivity in resist pattern formation is improved, but shape control and resolution deteriorate
Solution Approach 1:
The patent applies local quality by strategically positioning polar groups at specific locations within the acid diffusion controlling agent molecule. While the majority of the molecular structure maintains high hydrophobicity for sensitivity, the localized polar groups (such as carboxylic acid, hydroxyl, or ether groups) provide controlled interaction with the developing solution. This localized modification allows the compound to maintain high sensitivity while achieving improved shape control and resolution.
Solution Approach 2:
The patent applies parameter changes by precisely controlling the pKa value of the acid diffusion controlling agent within the range of 3.0-6.0 and adjusting the molecular weight and structural parameters. These parameter optimizations ensure that the compound maintains high sensitivity through its hydrophobic character while the controlled polarity and acid strength enable proper shape control and resolution during the development process.
Data Source
AI summary
A resist composition containing a base material component and a compound represented by General Formula (d0), in which in the formula, Rd0 represents a condensed cyclic group containing a condensed ring containing at least one aromatic rings, the condensed cyclic group having, as a substituent, an acid decomposable group which is decomposed under action of acid to form a polar group, Yd0 represents a divalent linking group or a single bond, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or more