Chemically Amplified Resist Composition for Acid Diffusion Control
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Solution Overview
Problem
Existing resist compositions struggle to achieve both high sensitivity and lithography properties, particularly in forming patterns with widths less than several tens of nanometers, as they do not adequately control acid diffusion during exposure.
Innovation Solution
A resist composition comprising a base material component, an acid generating agent, a first acid diffusion control component, and a second acid diffusion control component, where the first component contains a compound represented by general formula (d1-1) and the second component contains a compound represented by general formula (d2-1), which control acid diffusion and solubility changes in exposed and unexposed regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a chemically amplified resist composition containing an acid generating agent is used to achieve high sensitivity, then the sensitivity to light source is improved, but the acid diffusion from exposed to unexposed portions causes deterioration in lithography properties and pattern precision
Solution Approach 1:
The patent introduces a photoreactive quencher as an intermediary substance that selectively interacts with diffusing acid in unexposed regions. This quencher contains an anion moiety with specific structure that captures acid before it can reach unexposed portions, thereby preventing acid diffusion damage while preserving the high sensitivity enabled by the acid generating agent system.
Solution Approach 2:
The patent applies local quality by creating spatially differentiated acid concentration through the photoreactive quencher mechanism. In exposed regions, acid is generated and solubility changes occur normally. In unexposed regions, the photoreactive quencher locally captures diffusing acid, creating a local acid-free zone. This local differentiation maintains sharp pattern boundaries while preserving overall high sensitivity.
2Manufacturing precision
If the acid diffusion is controlled using a photoreactive quencher with anion moiety, then the lithography properties are improved, but the sensitivity to light source for exposure is insufficient for forming patterns less than several tens of nm
Solution Approach 1:
The patent employs a composite resist composition that integrates multiple functional components: base resin, acid generating agent, and photoreactive quencher with specific anion moiety structure. This composite formulation synergistically combines the high sensitivity capability of the acid generating agent system with the acid diffusion control capability of the photoreactive quencher, achieving both high sensitivity and excellent lithography properties.
3Length of moving object
If the resist composition uses wavelength shortening for miniaturization, then the pattern dimension is reduced, but the acid diffusion becomes more significant relative to the smaller pattern size
Solution Approach 1:
The photoreactive quencher acts as an intermediary barrier that becomes increasingly important as pattern dimensions shrink. With smaller patterns, the ratio of perimeter to area increases, making acid diffusion from exposed to unexposed regions more impactful. The photoreactive quencher provides localized acid capture that scales effectively with miniaturization, maintaining pattern shape accuracy even at sub-10nm dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of resist patterns with high sensitivity and improved lithography properties, allowing for precise pattern formation in semiconductor and liquid crystal display elements.
Implementation Method 1
a chemically amplified resist composition containing a base material component whose solubility with respect to a liquid developer changes by an action of an acid and an acid generating agent component that generates an acid upon exposure
Implementation Method 2
The photoreactive quencher is a component that undergoes an ion exchange reaction with the acid generated from the acid generating agent component to exhibit a quenching effect. By mixing such a photoreactive quencher, diffusion of the acid generated from the acid generating agent component from an exposed portion to an unexposed portion of a resist film can be controlled
Data Source
AI summary
A resist composition which generates an acid upon exposure and whose solubility with respect to a liquid developer changes by an action of the acid, the resist composition including a base material component whose solubility with respect to a liquid developer changes by an action of the acid, an acid generating agent component which generates an acid upon exposure, a first acid diffusion control component; and a second acid diffusion control component, in which the first acid diffusion control component (D1) includes a compound (d1-1), and the second acid diffusion control component (D2) includes a compound (d2-1).