Resist Composition With Acid Diffusion Control for Fine Pattern Resolution
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Solution Overview
Problem
Existing resist compositions, particularly those containing carboxylate acid diffusion control agents, face challenges in achieving high sensitivity and resolution for forming fine patterns in semiconductor and liquid crystal display elements, especially with exposure light sources of shorter wavelengths.
Innovation Solution
A resist composition that includes a resin component whose solubility in a development solution changes under the action of an acid, utilizing a compound represented by General Formula (d0), which generates an acid upon exposure, and an acid diffusion control agent containing this compound to form a resist pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a carboxylate acid diffusion control agent is used in the resist composition, then the resist pattern roughness is reduced and fine resolution is improved, but the sensitivity and lithography properties remain insufficient for forming fine patterns of several tens of nm
Solution Approach 1:
The patent changes the chemical structure parameters of the acid diffusion control agent by introducing specific substituents (Xd: iodine, fluorine, bromine, or fluorinated alkyl groups; Rd: various substituents) at defined positions in the molecular structure. This structural parameter modification optimizes both the acid diffusion control capability (improving resolution) and the sensitivity/lithography properties simultaneously, resolving the contradiction between pattern precision and process reliability
Solution Approach 2:
The patent creates a composite resist composition by combining the specifically structured compound (D0) with resin component (A1) whose solubility changes under acid action. This composite formulation integrates multiple functional components that work synergistically: compound (D0) controls acid diffusion for fine resolution while the resin component provides sensitivity and lithography performance, thus resolving the contradiction between resolution and sensitivity
2Manufacturing precision
If exposure light sources with shorter wavelengths are used to achieve finer pattern dimensions, then the resolution is improved, but the sensitivity and lithography properties become more difficult to maintain
Solution Approach 1:
The patent modifies the molecular parameters of the acid diffusion control agent (compound D0) including atomic composition (introducing heavy atoms like iodine, fluorine, or bromine), substituent types (Rd groups), and molecular architecture (nd and md values). These parameter changes optimize the compound's interaction with short-wavelength exposure light, enhancing both resolution capability and sensitivity response to the exposure source being used
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high sensitivity and favorable lithography properties, enabling the formation of fine patterns with improved resolution and shape fidelity.
Implementation Method 1
an acid generator component that generates an acid upon exposure
Implementation Method 2
an acid diffusion control agent
Data Source
AI summary
A resist composition containing a resin component whose solubility in a development solution changes under the action of the acid and a compound represented by General Formula (d0). In the formula, Ar is an aromatic ring; Xd is an iodine atom, a fluorine atom, a bromine atom or a fluorinated alkyl group; Rd is a substituent; nd is an integer of 1 or more as long as the valence allows, and md is an integer of 0 or more as long as the valence allows; Ld is a single bond or a divalent linking group; m is an integer of 1 or more, and Mm+ is an m-valent cation