Resist Composition Acid-Labile Groups High-Energy Resolution

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Solution Overview

Problem

Current resist compositions face challenges in achieving high resolution and adhesion to substrates during pattern formation, particularly when exposed to high-energy rays, due to limitations in acid-labile groups and hydroxy groups in existing resins.

Innovation Solution

A resist composition comprising a resin with a structural unit derived from a specific compound, formulated with an acid generator and an acid-labile group, which includes a structural unit having an acid-labile group and a hydroxy group, enhancing the resolution and adhesion properties when exposed to high-energy sources.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If existing resins with limited acid-labile groups and hydroxy groups are used, then the resist composition can be formulated with conventional structures, but the pattern resolution and adhesion to substrates deteriorate when exposed to high-energy rays

Engineering Contradiction:
Improvepattern resolutionVSAvoidadhesion to substrate
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent employs a composite resin structure containing multiple functional units: structural unit (A) with acid-labile groups for resolution enhancement, structural unit (B) with hydroxy groups for adhesion improvement, and structural unit (C) as the base resin matrix. This composite approach allows simultaneous optimization of pattern resolution and substrate adhesion by combining materials with complementary functions.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent introduces specific functional groups at localized positions within the resin molecule. The acid-labile groups (such as t-butoxycarbonyl) are positioned to provide targeted resolution enhancement during exposure, while hydroxy groups are incorporated to specifically improve adhesion to substrates. This localized functionalization allows different regions of the resin to perform specialized functions.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the resin structure is optimized for high resolution through acid-labile groups, then pattern formation precision improves, but adhesion performance to substrates worsens

Engineering Contradiction:
Improvepattern formation precisionVSAvoidadhesion strength
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The patent designs the resin to perform multiple functions simultaneously through its composite structure. The resin composition includes units that provide acid-labile functionality for precision patterning, while other units contribute hydroxy groups for adhesion. This multi-functional design allows a single resin material to satisfy both resolution and adhesion requirements without requiring separate specialized materials.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

By combining structural unit (A) with acid-labile groups, structural unit (B) with hydroxy groups, and structural unit (C) base resin in specific ratios (where structural unit (A) + structural unit (B) content is 1-50 mol% based on total structural units), the patent creates a composite material that achieves both high pattern formation precision and strong substrate adhesion.

Inventive Principle:
Principle #40Composite materials

3Ease of manufacture

If conventional resist compositions are used, then the formulation is simple and well-established, but the performance in achieving high resolution and adhesion under high-energy ray exposure deteriorates

Engineering Contradiction:
Improveformulation simplicityVSAvoidresolution and adhesion performance
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent modifies key parameters of conventional resist formulations by incorporating specific functional groups (acid-labile groups and hydroxy groups) into the resin structure. This changes the chemical properties of the resin to enable high-resolution patterning and improved adhesion under high-energy ray exposure, while maintaining a formulation approach that builds on conventional resist composition methods.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resist composition improves pattern resolution and adhesion to substrates by effectively utilizing the acid-labile group and hydroxy group, optimizing the resist pattern formation process.

Implementation Method 1

a salt represented by formula (B1) as an acid generator, wherein... the resist composition improves pattern resolution and adhesion to substrates by effectively utilizing the acid-labile group and hydroxy group

Methodology Applied
Scientific EffectPhotoacid generation: Photodissociation

Data Source

PatentUS11822244B2Compound, resin, resist composition and method for producing resist pattern
Publication Date: 2023.11.21 SUMITOMO CHEM CO LTD
  • US11822244B2 patent drawing
  • US11822244B2 patent drawing
  • US11822244B2 patent drawing

AI summary

Disclosed are a compound represented by formula (I), a resin and a resist composition:wherein R1 represents an alkyl group having 1 to 6 carbon atoms which may have a halogen, hydrogen or halogen atom, R2 and R3 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms, R4 represents a fluorine atom, an alkyl fluoride group having 1 to 6 carbon atoms or an alkyl group having 1 to 12 carbon atoms, and —CH2— included in the alkyl fluoride group and the alkyl group may be replaced by —O— or —CO—, R5 represents a hydrogen atom, an alkylcarbonyl group having 2 to 6 carbon atoms or an acid-labile group, m2 represents an integer of 1 to 4, m4 represents an integer of 0 to 3, and m5 represents 1 or 2, in which 2≤m2+m4+m5≤5.