Resist Composition Apparatus Cleaning for Defect Reduction
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Solution Overview
Problem
The challenge in semiconductor manufacturing is the occurrence of coating defects, particularly 'siloxane gel', in silicon-containing resist underlayer films, which leads to pattern defects and electrical faults in semiconductor apparatuses, due to the formation of higher molecular weight polymers during the production process, and existing filtration methods are insufficient to remove these defects effectively.
Innovation Solution
A method involving the repeated application and measurement of a cleaning liquid on an evaluation substrate to reduce the density of defects to specific thresholds, ensuring the apparatus producing the resist composition is thoroughly cleaned, thereby minimizing the introduction of polysiloxane gel into the resist composition, which is then used to produce a defect-reduced silicon-containing resist underlayer film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If filtration by using a filter is used to remove siloxane gel, then some deposits are removed, but small defects pass through and coating defects remain
Solution Approach 1:
The patent introduces a cleaning liquid as an intermediary substance to remove siloxane gel deposits from the apparatus. The cleaning liquid circulates through the production apparatus, dissolves and carries away the silicone-containing deposits, and is then filtered and reused. This intermediary cleaning process effectively removes defects that would otherwise pass through the production filter.
Solution Approach 2:
The patent implements preliminary cleaning action by circulating the cleaning liquid through the production apparatus before actual resist composition production begins. This pre-cleaning step removes accumulated siloxane gel from pipes, filters, and other components, preventing defect generation during subsequent production runs.
2Reliability
If a silicon-containing resist underlayer film composition is used, then etching selectivity and coating property are improved, but siloxane gel deposits are generated in the production apparatus
Solution Approach 1:
The patent converts the harmful effect of siloxane gel deposit generation into a beneficial cleaning process. The cleaning liquid is specifically designed to dissolve and remove the silicone-containing deposits that are inevitably generated during production, transforming the problematic byproduct into something that can be effectively managed and removed through the cleaning system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces coating defects in the resist composition, enabling defect-free pattern transfer during dry etching and improving the yield of semiconductor apparatuses, particularly suitable for advanced patterning techniques like liquid immersion exposure and double patterning.
Implementation Method 1
cleaning an apparatus for producing the resist composition with a cleaning liquid
Implementation Method 2
applying the cleaning liquid on an evaluation substrate by spin-coating
Data Source
AI summary
The present invention provides a method for producing a resist composition used in a process for producing a semiconductor apparatus, the method including the steps of: cleaning an apparatus for producing the resist composition with a cleaning liquid; applying the cleaning liquid on an evaluation substrate by spin-coating after removing the cleaning liquid from the apparatus for producing the resist composition; repeating the step of cleaning and the step of applying until the change in the density of defects having a size of 100nm or more on the evaluation substrate between before and after the application of the cleaning liquid becomes 0.2/cm2 or less; and producing the resist composition by using the apparatus for producing the resist composition after the step of repeating. There can be provided a method for producing a resist composition capable of producing a resist composition whose coating defects are reduced.