Resist Coating Apparatus Reducing Line Width Roughness
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Solution Overview
Problem
Existing resist coating and developing technologies face challenges in reducing line width roughness of resist patterns, which can lead to variations in threshold voltage of field-effect transistors, and are prone to solvent gas diffusion, causing operational issues and safety concerns.
Innovation Solution
A resist coating and developing apparatus and method that includes a solvent gas generator and conditioner to create a controlled environment within a processing chamber, reducing pressure and preventing solvent gas diffusion, while using a solvent vapor to dissolve and flatten resist films, thereby reducing line width roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a solvent gas is supplied to a resist film to dissolve the surface and flatten irregularities, then the line width roughness is reduced, but the solvent gas may diffuse in the apparatus and expose the resist film before development, causing neutralization of acidic components and making patterning impossible
Solution Approach 1:
The apparatus is divided into distinct functional units: a solvent gas generator that produces solvent vapor, a conditioner that controls the vapor, and a processing chamber that houses the substrate. This segmentation isolates the solvent generation and delivery processes, preventing premature exposure of the resist film while enabling controlled application for flattening to reduce line width roughness
Solution Approach 2:
A carrier gas acts as an intermediary medium to transport the solvent vapor from the generator through the conditioner to the processing chamber. This intermediary system allows precise control over solvent delivery, ensuring the resist film is exposed to solvent vapor only at the intended stage for flattening, not during earlier processing steps where it would cause neutralization and patterning failure
2Manufacturing precision
If a solvent with strong pungent odor is used to flatten the resist film, then the line width roughness is reduced, but the diffused gas gives an unpleasant feeling to the operator
Solution Approach 1:
The processing chamber is maintained as a sealed, controlled environment where solvent vapor is confined during the flattening process. This inert atmosphere approach prevents pungent solvent gases from escaping into the surrounding space, protecting operator comfort while still enabling effective resist film flattening to reduce line width roughness
Solution Approach 2:
The processing chamber acts as a sealed enclosure (flexible shell concept) that contains the solvent vapor. This physical barrier prevents the diffusion of pungent solvent gases into the operator environment, allowing the use of effective solvents for resist flattening without compromising operator comfort
3Object-affected harmful factors
If the processing chamber is sealed to prevent solvent gas diffusion, then operator comfort is protected, but the chamber needs to be evacuated to reduced pressure for proper solvent gas supply
Solution Approach 1:
An exhaust system with vacuum pumps is integrated with the processing chamber to create and maintain reduced pressure conditions. This pneumatic system enables controlled solvent vapor supply by creating a pressure gradient that draws solvent vapor through the carrier gas to the substrate, while the sealed chamber prevents solvent gas diffusion to protect operator comfort
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces line width roughness of resist patterns, preventing solvent gas contamination and ensuring safe operation by confining the solvent within the processing chamber, thus improving the precision and reliability of semiconductor manufacturing.
Implementation Method 1
a solvent gas containing a vapor of a solvent having a property of dissolving the resist film
Implementation Method 2
an exhaust system connected to the processing chamber to evacuate the processing chamber to a reduced pressure
Data Source
AI summary
A resist coating/developing apparatus includes: a resist film-forming unit configured to apply a resist onto a substrate to form thereon a resist film; a resist developing unit configured to develop the resist film after exposure to pattern the resist film; a solvent gas generator configured to generate a solvent gas containing a vapor of a solvent having a property of dissolving the resist film; a solvent gas conditioner connected to the solvent gas generator and configured to condition the solvent gas generated in the solvent gas generator; a processing chamber configured to house the substrate having thereon the resist film which has been developed and patterned in the resist developing unit, and connected to the solvent gas conditioner so that the solvent gas, which has been conditioned in the solvent gas conditioning section, is supplied to the substrate housed in the processing chamber; and an exhaust system connected to the processing chamber to evacuate the processing chamber to a reduced pressure.