Resist Coating Liquid for Finer Pattern Formation
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Solution Overview
Problem
Existing methods for forming resist patterns face challenges such as high surface tension in aqueous solutions, variability in pattern formation without polymers, the need for high-temperature baking, and inability to reduce resist pattern width or diameter effectively.
Innovation Solution
A coating liquid comprising a polymer with hydroxy or carboxy groups, a sulfonic acid, and an organic solvent, which allows for uniform application and reduction of resist pattern width without surfactants, and can be used to form both resist and reverse patterns using specific heating and developing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an aqueous solution containing a water-soluble resin is used as a coating liquid, then the resin can be dissolved and applied, but the high surface tension of water makes it difficult to apply uniformly to the resist pattern
Solution Approach 1:
The patent introduces a surfactant as an intermediary substance between the aqueous resin solution and the resist pattern. The surfactant reduces the surface tension of water, enabling the coating liquid to spread uniformly over the resist pattern surface without requiring modification of the water itself or the resist pattern.
Solution Approach 2:
The patent changes the surface tension parameter of the aqueous solution by adding surfactants or mixing with water-soluble alcohols. This parameter modification allows the liquid to wet the resist pattern surface effectively, transforming the coating properties from non-applicable to uniformly applicable.
2Device complexity
If a coating liquid without polymer is used, then application is simplified, but the ratio of formed finer pattern varies depending on the shape of the target resist pattern
Solution Approach 1:
The patent uses a polymer component that provides homogeneous interaction across different resist pattern shapes. The polymer ensures consistent coating behavior and pattern formation ratio whether the target pattern is linear, circular, or other geometries, eliminating the variability observed in polymer-free formulations.
3Manufacturing precision
If an acid generator component is added to form a finer pattern, then pattern reduction is achieved, but high-temperature baking at 130°C or additional exposure steps are required
Solution Approach 1:
The patent extracts the acid generator component from the coating liquid formulation, eliminating the need for high-temperature baking or additional exposure steps. The pattern reduction function is achieved through the polymer and surfactant combination alone, simplifying the overall processing workflow.
Solution Approach 2:
The coating liquid formulation itself provides the pattern reduction capability through its polymer and surfactant components, without requiring external assistance from acid generators or additional processing steps. The system serves its own pattern reduction function through the inherent properties of its constituents.
4Manufacturing precision
If heating is applied after coating to form a finer pattern, then pattern width is reduced, but the method only narrows spaces between patterns rather than reducing resist pattern width itself
Solution Approach 1:
The patent inverts the conventional approach by using a polymer-based coating liquid that directly reduces resist pattern width through its chemical composition, rather than using heating to narrow spaces between patterns. The polymer formulation itself performs the width reduction function, achieving the opposite effect of the conventional space-narrowing method.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coating liquid enables uniform reduction of resist pattern width and diameter, facilitating the formation of finer patterns suitable for future EUV exposure technologies, and can be applied to various pattern shapes without deforming the substrate.
Implementation Method 1
an organic solvent capable of dissolving the polymer
Implementation Method 2
a surfactant is required to be added to the aqueous solution
Implementation Method 3
heating the substrate onto which the coating liquid for resist pattern coating is applied at 50° C. to 130° C. to form a coated film
Data Source
AI summary
There is provided a new coating liquid for resist pattern coating. A coating liquid for resist pattern coating comprising a component A that is a polymer including at least one hydroxy group or carboxy group; a component B that is a sulfonic acid of A-SO3H (where A is a linear or branched alkyl group or fluorinated alkyl group having a carbon atom number of 1 to 16, an aromatic group having at least one of the alkyl group or the fluorinated alkyl group as a substituent, or a C4-16 alicyclic group optionally having a substituent); and a component C that is an organic solvent capable of dissolving the polymer and including ether or ketone compound of R1—O—R2 and/or R1—C(═O)—R2 (where R1 is a linear, branched, or cyclic alkyl group or fluorinated alkyl group having a carbon atom number of 3 to 16; and R2 is a linear, branched, or cyclic alkyl group or fluorinated alkyl group having a carbon atom number of 1 to 16), a method of forming a resist pattern using the coating liquid, and a method for forming a reverse pattern using the coating liquid.