Resist Composition for EUV Lithography with Acid Generator
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current resist compositions face challenges in achieving both high sensitivity and satisfactory lithography characteristics, particularly in forming fine patterns with reduced roughness and high resolution using EUV and EB, as they struggle to balance sensitivity and CDU (Critical Dimension Uniformity).
Innovation Solution
A resist composition is developed that includes a resin component with specific constitutional units and an acid generator component, which generates acid upon light exposure, altering solubility in a developing solution. This composition features constitutional units represented by General Formulas (a0-1) and (a0-2), enhancing acid generation and diffusion control, thereby improving contrast between exposed and unexposed areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the resist pattern dimensions are decreased to achieve finer patterns, then the resolution is improved, but the roughness increases and lithography characteristics deteriorate
Solution Approach 1:
The patent modifies the chemical structure of the resin component by introducing specific constitutional units with acid-generating groups and acid-decomposable groups. This structural parameter change enables the resin to generate acid upon light exposure, which then decomposes the acid-decomposable groups to increase polarity and enhance solubility contrast between exposed and unexposed regions, thereby improving both resolution and reducing roughness in fine patterns
Solution Approach 2:
The patent creates a composite resin system combining multiple functional units: (a01) acid-generating units that produce acid upon light exposure, (a02) acid-decomposable units that increase polarity when exposed to acid, and (a03) cyclic hydrocarbon units with polar groups. This composite structure enables synergistic effects where the acid generated from (a01) triggers decomposition of (a02), creating a amplified solubility contrast that improves lithography characteristics for fine patterns
2Productivity
If conventional resist compositions are used, then the manufacturing process is simple, but both sensitivity and lithography characteristics cannot be achieved simultaneously
Solution Approach 1:
The patent changes the chemical parameters of the resist composition by incorporating resin components with specific acid-generating constitutional units (a01) that have optimized light absorption and acid generation efficiency. This parameter optimization enables high sensitivity to exposure light while the accompanying acid-decomposable units (a02) ensure precise contrast control, achieving both high sensitivity and good CDU simultaneously
Solution Approach 2:
The patent introduces acid as an intermediary substance that mediates between the exposed and unexposed regions. The acid generated in exposed regions by constitutional units (a01) acts as a mediator to trigger the decomposition of acid-decomposable groups (a02), creating a amplified solubility contrast that improves both sensitivity and critical dimension uniformity without compromising the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition achieves increased sensitivity and improved lithography characteristics, including reduced roughness and enhanced CDU, enabling the formation of fine patterns with improved shape and resolution.
Implementation Method 1
an acid generator component (B) which generates an acid upon light exposure
Implementation Method 2
a resin component (A1) whose solubility in the developing solution is changed due to the action of the acid
Data Source
AI summary
A resist composition including a resin component (A1) which has a constitutional unit (a0) containing a photodegradable base that is decomposed upon light exposure and loses acid diffusion controllability, and an acid generator component (B) which contains a compound (BO) represented by General Formula (b0) in which X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, an alkyl group, a fluorine atom, or a chlorine atom, nb1 represents an integer of 1 to 5, and nb2 represents an integer of 0 to 4, where 1≤nb1+nb2≤5 is satisfied, Yb0 represents a divalent linking group or a single bond, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a hydrogen atom, a fluorinated alkyl group having 1 to 5 carbon atoms, or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or greater


