Resist Composition Merging Acid Generator and Base for Lithography
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Solution Overview
Problem
Current chemically amplified resist compositions face challenges in achieving improved lithography properties such as resolution and line edge roughness (LER) as pattern sizes decrease, leading to defects in resist patterns, particularly in semiconductor manufacturing.
Innovation Solution
A resist composition incorporating a polymeric compound with a specific structural unit that acts as both an acid generator and base component, changing solubility in an alkali developing solution upon exposure, allowing for precise formation of fine resist patterns with enhanced lithography properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional chemically amplified resist compositions are used, then lithography properties such as resolution and line edge roughness can be improved, but defects in resist patterns occur as pattern sizes decrease
Solution Approach 1:
The patent combines the acid generator function and base component function into a single polymeric compound. The polymeric compound contains both an acid-generating group (such as onium salt) and a base component with changed solubility upon acid exposure. This integration eliminates the need for separate acid generator and base component, reducing compositional complexity and potential sources of defects while maintaining the chemically amplified resist mechanism for improved resolution and line edge roughness.
Solution Approach 2:
The polymeric compound serves multiple functions simultaneously: it acts as the base component forming the resist film, contains the acid-generating group for chemical amplification, and provides the solubility change mechanism for pattern formation. This multi-functionality reduces the number of components needed in the resist composition, simplifying the system while improving manufacturing precision and reducing defects.
2Manufacturing precision
If separate acid generator and base component are used in chemically amplified resist, then lithography properties can be optimized, but composition complexity increases
Solution Approach 1:
The patent merges the acid generator and base component into a single polymeric compound structure. The polymeric compound contains both the acid-generating group (such as onium salt) and the base component with acid-responsive solubility changes. This consolidation reduces compositional complexity while maintaining the dual functionality needed for optimized lithography properties.
Solution Approach 2:
The polymeric compound performs multiple functions within a single component: film formation, acid generation, and solubility change upon exposure. This multi-functionality eliminates the need for separate acid generator and base component, thereby reducing composition complexity while preserving lithography performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition effectively forms very fine resist patterns with improved resolution and reduced line edge roughness, minimizing defects and enhancing the formation of intricate semiconductor elements.
Implementation Method 1
a polymeric compound containing an acid-generating group which generates an acid upon exposure
Implementation Method 2
the action of generated acid causes the acid-dissociable, dissolution-inhibiting groups to dissociate to form an alkali soluble group
Implementation Method 3
the resist film is subjected to selective exposure of radial rays such as light or electron beam
Data Source
AI summary
According to the present invention, there are provided a resist composition which can form a very fine resist pattern with excellent lithography properties, a new polymeric compound useful for the resist composition, and a compound useful as a monomer for the polymeric compound. The aforementioned resist composition contains a polymeric compound (A) containing a structural unit (a0) represented by general formula (a0) shown below. In the formula (a0), A is an anion represented by the general formula (1) or (2).