Resist Composition with Acid-Labile Resin for Lithography Resolution
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Solution Overview
Problem
Current resist compositions for pattern formation lack effective resolution and dry-etching tolerance, particularly in advanced lithography processes, due to limitations in acid-labile groups and fluorine-containing compounds.
Innovation Solution
A resist composition incorporating a specific compound represented by formula (I) with a structural unit derived from it, combined with an acid-labile group-containing resin and an acid generator, which improves pattern resolution and dry-etching tolerance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resist compositions are used, then basic pattern formation is possible, but resolution and dry-etching tolerance are insufficient
Solution Approach 1:
The patent employs a composite resin system combining three distinct resin components: a carboxylic acid-resistant resin with specific structural units (formula 1), an acid-labile group-containing resin, and a third resin component. This composite approach integrates multiple functional properties into a single resist composition, achieving both high resolution and dry-etching tolerance that cannot be obtained with conventional single-resin systems.
Solution Approach 2:
The patent introduces specific structural units with localized functional properties: the carboxylic acid-resistant structural unit (formula 1) provides etch tolerance in specific regions, while acid-labile groups provide controlled solubility changes. The fluorine-containing compound (formula 2) with specific perfluoroalkyl groups provides localized chemical resistance and resolution enhancement, creating heterogeneous functional zones within the resist material.
2Manufacturing precision
If acid-labile groups are increased to improve resolution, then pattern definition improves, but dry-etching tolerance deteriorates
Solution Approach 1:
The patent segments the resist composition into functionally distinct resin components: the carboxylic acid-resistant resin (formula 1) provides dry-etching resistance, the acid-labile group-containing resin provides pattern definition through controlled solubility, and the third resin component fine-tunes the balance between these properties. This segmentation allows each component to optimize its specific function without compromising the other.
Solution Approach 2:
The patent utilizes parameter changes in the chemical structure of the resins, specifically the ratio and types of acid-labile groups versus carboxylic acid-resistant groups, to adjust the balance between resolution and etch tolerance. By modifying the molecular weight, functional group density, and structural composition of each resin component, the resist achieves optimal performance characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enhances pattern resolution and dry-etching tolerance, enabling better performance in advanced lithography processes by utilizing the compound's unique structural unit and acid-labile group synergy.
Implementation Method 1
exposing the composition layer; heating the exposed composition layer, and developing the heated composition layer
Data Source
AI summary
A compound represented by formula (I), a resin including a structural unit derived from the compound and a resist composition including the resin:wherein R1 represents a hydrogen atom, a halogen atom or a C1 to C6 alkyl group in which a hydrogen atom may be replaced by a halogen atom, R2 represents a C1 to C6 perfluoroalkyl group or *—CHRf1Rf2, * represents a binding site to a carbonyl group, Rf1 and Rf2 each independently represent a C1 to C4 perfluoroalkyl group or Rf1 and Rf2 may be bonded together with a carbon atom bonded thereto to form a ring, A1 represents a single bond, a C1 to C6 alkanediyl group or **-A3-X1-(A4-X2)a-(A5)b-, ** represents a binding site to an oxygen atom, A2, A3, A4 and A5 each independently represent a C1 to C6 alkanediyl group, X1 and X2 each independently represent —O—, —CO—O— or —O—CO—, a and b each represent 0 or 1, and W1 represents a C5 to C18 divalent alicyclic hydrocarbon group.