Resist Composition for High Sensitivity EUV Lithography

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Solution Overview

Problem

Current resist compositions containing onium salt-based acid generators struggle to achieve high sensitivity and desired resist pattern shapes, especially when exposed to extreme ultraviolet light, leading to difficulties in forming fine resist patterns with improved lithography properties.

Innovation Solution

A resist composition is developed that includes a base material component with a specific structural unit and an acid generator component, which generates acid upon exposure, altering solubility in a developing solution. This composition forms a resist film that changes solubility in response to acid exposure, allowing for the formation of high-sensitivity resist patterns with improved lithography properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If onium salt-based acid generators are used in resist composition, then the resist can form patterns through acid generation upon exposure, but the sensitivity and pattern shape quality deteriorate under extreme ultraviolet light exposure

Engineering Contradiction:
Improveresist pattern formation capabilityVSAvoidlithography properties and pattern shape
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the chemical structure parameters of the acid generator from conventional onium salts to cyclic carboxylic acid imide compounds with specific molecular structures (formula 1). This structural parameter change enables high sensitivity to extreme ultraviolet light while maintaining excellent resist pattern formation, resolving the contradiction between reliability and manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite resist system combining the novel cyclic carboxylic acid imide acid generator (formula 1) with specific base resins (formula 2) and optional co-acid generators (formula 3). This composite material approach synergistically improves both the sensitivity and the lithography properties, achieving excellent resist patterns that neither component could achieve alone.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If the wavelength of exposure light source is shortened to achieve pattern miniaturization, then the resolution improves, but the sensitivity requirement of resist material increases

Engineering Contradiction:
Improvepattern dimension and resolutionVSAvoidsensitivity of resist material
Core Design Contradiction:
Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The patent modifies the acid generation parameters by using cyclic carboxylic acid imide compounds that generate acid more efficiently upon extreme ultraviolet exposure. The specific molecular structure (formula 1) with its cyclic imide group enables higher quantum efficiency for acid generation, thereby increasing resist sensitivity to match the requirements of short-wavelength lithography.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The cyclic carboxylic acid imide compound acts as an intermediary that converts extreme ultraviolet energy into acid more efficiently than conventional onium salts. This intermediary mechanism bridges the gap between the high energy of short-wavelength light and the chemical change needed for pattern formation, enabling both high resolution and high sensitivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resist composition effectively forms excellent shaped resist patterns with high sensitivity and improved lithography properties, addressing the challenges faced by existing compositions, particularly under extreme ultraviolet exposure.

Implementation Method 1

an acid generator component (B) which generates an acid upon exposure

Methodology Applied
Scientific EffectPhotoacid generation: Photoionisation

Data Source

PatentUS10241406B2Resist composition and method for forming resist pattern
Publication Date: 2019.03.26 TOKYO OHKA KOGYO CO LTD
  • US10241406B2 patent drawing
  • US10241406B2 patent drawing
  • US10241406B2 patent drawing

AI summary

A resist composition containing a resin component having a structural unit represented by general formula (a0-1), and a compound represented by general formula (b1). In general formula (a0-1), R is a hydrogen atom, an alkyl group, or a halogenated alkyl group. Va1 is a divalent hydrocarbon group. na1 represents an integer of 0 to 2. Ra′12 and Ra′13 are a monovalent chain saturated hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom. Ra′14 is a phenyl group, a naphthyl group, or an anthryl group. In general formula (b1), Rb1 represents a cyclic hydrocarbon group. Yb1 represents a divalent linking group containing an ester bond. Vb1 represents an alkylene group, a fluorinated alkylene group, or a single bond. m is an integer of 1 or more, and Mm+ is an m-valent organic cation.