Resist Composition for EUV Lithography Resolution and Sensitivity
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Solution Overview
Problem
Current resist compositions used in semiconductor manufacturing, particularly with high-energy rays like EUV, face challenges in achieving improved sensitivity and resolution due to the low photon count, leading to increased noise and reduced thermal stability, and the high content of photoacid generators can deteriorate pattern resolution.
Innovation Solution
A resist composition comprising a polymer with a specific repeating unit, a photoacid generator, and an organic solvent, which generates acids effectively with a small amount of light, improving resolution and solubility in developing solutions, thereby enhancing pattern quality and reducing noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high-energy rays (EUV) are used for lithography, then smaller feature sizes can be achieved, but the low photon count leads to increased noise and reduced sensitivity
Solution Approach 1:
The patent changes the chemical parameters of the resist composition by incorporating specific base resins with carboxylic acid groups and catalysts that work efficiently with EUV photons. This optimization allows the resist to achieve high sensitivity and resolution simultaneously by tuning the chemical response to low-photon-count EUV exposure
Solution Approach 2:
The patent uses a composite resist system combining base resin, photoacid generator, and catalyst in specific ratios. This composite approach enables the resist to efficiently utilize limited EUV photons while maintaining pattern resolution, resolving the contradiction between sensitivity and manufacturing precision
2Reliability
If high content of photoacid generators is used to improve sensitivity, then better pattern formation is achieved, but pattern resolution deteriorates
Solution Approach 1:
The patent optimizes the concentration and type of photoacid generator to achieve a balance where sufficient acid is generated for sensitivity while avoiding excessive acid that would harm resolution. The specific ratio of photoacid generator to base resin and catalyst is tuned to resolve this contradiction
Solution Approach 2:
The patent introduces catalysts that enable localized and controlled acid generation and diffusion. This allows the acid to be generated efficiently where needed (improving sensitivity) while limiting its spread (maintaining resolution), thus resolving the contradiction
3Stability of the object's composition
If low exposure doses are used to reduce damage, then thermal stability is maintained, but sensitivity is reduced
Solution Approach 1:
The patent modifies the thermal and chemical parameters of the resist components to enable efficient acid generation at low exposure doses. The base resin and catalyst system is designed to maximize acid generation efficiency, allowing high sensitivity at low doses while maintaining thermal stability through optimized composition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition achieves improved sensitivity and resolution, maintaining thermal stability and reducing foreign matter issues, even with low exposure doses, by effectively generating acids and optimizing solubility in developing solutions.
Implementation Method 1
acids, formed by the reaction of light with photoacid generators
Data Source
AI summary
Provided are a resist composition and a pattern forming method using the same. The resist composition includes a polymer including a first repeating unit repeating unit Formula 1, a photoacid generator, and an organic solvent.In Formula 1, L11 to L13, a11 to a13, A11 to A13, R11 to R14, b12 to b14, and p are the same as described in the detailed description.