Chemically Amplified Resist Composition for High Heat Resistance
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Solution Overview
Problem
Current photolithographic resists used in semiconductor production lack sufficient heat resistance, particularly for KrF exposure, where existing high heat-resistant resists do not maintain pattern integrity at higher temperatures.
Innovation Solution
A chemically amplified negative-type resist composition comprising a specific polymer, crosslinking agent, acid generating agent, and solvent, which forms a high-resolution pattern with improved heat resistance by incorporating a polymer with a particular repeating unit, a crosslinking agent with specific hydrocarbon groups, and an acid generating agent, followed by a pattern formation process involving pre-baking, exposure, and post-exposure baking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If polyimide-containing photoresist is used to achieve high heat resistance, then heat resistance is improved, but resolution capability for KrF exposure deteriorates
Solution Approach 1:
The patent employs a composite resist system combining polyimide polymer (providing heat resistance) with specific crosslinking agents (providing KrF exposure responsiveness). The polyimide backbone maintains thermal stability while the crosslinking agents enable high-resolution patterning through acid-catalyzed crosslinking reactions upon KrF exposure, thus resolving the contradiction between heat resistance and resolution capability
Solution Approach 2:
The patent modifies the chemical parameters of the polyimide system by introducing crosslinking agents with specific functional groups that respond to KrF exposure. This changes the resist's chemical reactivity parameters while maintaining the polyimide's thermal properties, enabling both high heat resistance and high resolution to be achieved simultaneously
2Temperature
If existing high heat-resistant resist is used, then heat resistance is improved to 130-150°C, but heat resistance at higher temperatures deteriorates
Solution Approach 1:
The patent applies preliminary crosslinking action during the exposure and post-exposure bake steps, creating a crosslinked network structure before the final high-temperature processing. This pre-formed crosslinked structure provides enhanced thermal stability and pattern integrity at temperatures exceeding 150°C, preventing pattern degradation during subsequent manufacturing steps
3Temperature
If chemically amplified negative-type resist composition is used with specific polymer and crosslinking agent, then heat resistance is improved to maintain pattern at 350°C, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple functions into a single integrated resist composition: the polyimide polymer provides both the base structure and heat resistance, while the incorporated crosslinking agents simultaneously enable KrF exposure responsiveness and enhance high-temperature stability. This consolidation achieves superior heat resistance (pattern stability at 350°C) without significantly increasing manufacturing complexity, as the crosslinking occurs in-situ during the standard exposure and bake process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition achieves high sensitivity and resolution, maintaining pattern shape even at 350°C for 60 seconds and reducing pattern width fluctuations caused by standing waves, with a resolution of 100 to 300 nm.
Implementation Method 1
chemically amplified negative-type resist composition... exposing to light the substrate coated with the composition layer... carrying out post exposure baking
Implementation Method 2
a crosslinking agent represented by the following formula (IIa) or (IIb)... maintaining pattern shape even after held at 350° C. for 60 seconds
Implementation Method 3
maintaining pattern shape even after held at 350° C. for 60 seconds... high heat resistance resist composition
Data Source
AI summary
[Problem] To provide a high heat resistance resist composition and a pattern formation method using the composition.[Solution] The present invention provides a chemically amplified negative-type resist composition comprising a particular polymer and a particular crosslinking agent, and this composition makes it possible to form a resist pattern of high sensitivity, of excellent resolution and of strong heat-resistance.