Chemically Amplified Resist Composition for Immersion Lithography Defect Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In liquid immersion lithography, defects are formed due to residual fluid droplets on the resist film, particularly during post-exposure baking, which are associated with the receding contact angle of the resist film, and existing chemically amplified positive resist compositions do not adequately suppress these defects.
Innovation Solution
A chemically amplified positive resist composition is developed, comprising a resin (A) without fluorine atoms and a resin (B) with fluorine-containing groups, along with specific structural units and an acid generator, where the amount of resin (B) is limited to 2 parts by weight or less per 100 parts of resin (A), to enhance the receding contact angle and solubility in developing solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a chemically amplified positive resist composition is used in liquid immersion lithography, then the manufacturing precision can be improved, but defect formation due to residual fluid droplets occurs during post-exposure baking
Solution Approach 1:
The patent changes the chemical composition parameters of the resist by incorporating resin (B) containing fluorine-containing groups and specific structural units (b1-b4). This compositional parameter change modifies the surface properties of the resist film, specifically increasing the receding contact angle, which prevents residual fluid droplet formation during post-exposure baking while maintaining pattern formation precision
Solution Approach 2:
The patent creates a composite resist system by combining resin (A) without fluorine atoms and resin (B) with fluorine-containing groups in a specific weight ratio (0.005-2 parts by weight per 100 parts by weight of resin A). This composite material approach allows the resist to exhibit both good solubility in developing solutions and high resistance to fluid droplet adhesion, resolving the contradiction between manufacturing precision and defect formation
2Reliability
If the amount of resin (B) is increased to improve receding contact angle, then defect formation is suppressed, but solubility in developing solution may deteriorate
Solution Approach 1:
The patent optimizes the concentration parameter of resin (B) within the specific range of 0.005-2 parts by weight per 100 parts by weight of resin (A). This parameter optimization ensures that the receding contact angle is sufficiently increased to suppress defect formation, while the solubility in developing solutions is maintained at acceptable levels by preventing excessive fluorine content that would reduce solubility
Solution Approach 2:
The patent introduces specific structural units (b1-b4) with localized functional groups into resin (B). These structural units provide specific local properties: acid-labile groups for controlled decomposition, hydroxyl groups for hydrogen bonding and solubility, lactone structures for specific interactions, and fluorine-containing groups for surface energy modification. This local quality approach allows the resist to achieve high reliability in defect suppression while maintaining ease of manufacture through good solubility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively suppresses defect formation by forming a resist film with a higher receding contact angle, improving pattern profile and solubility, making it suitable for liquid immersion lithography.
Implementation Method 1
a chemically amplified positive resist composition comprising: a resin (A) which contains no fluorine atom and a structural unit (a1) having an acid-labile group in a side chain
Data Source
AI summary
The present invention provides a chemically amplified resist composition comprising:a resin (A) which contains no fluorine atom and a structural unit (a1) having an acid-labile group in a side chain,a resin (B) which contains a structural unit (b2) having a fluorine-containing group in a side chain and at least one structural unit selected from the group consisting of a structural unit (b1) having an acid-labile group, a structural unit (b3) having a hydroxyl group and a structural unit (b4) having a lactone structure in a side chain, andan acid generator, wherein the amount of the resin (B) is 2 parts by weight or less per 100 parts by weight of the resin (A).