Chemically Amplified Resist Composition for Lithography Resolution

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Solution Overview

Problem

Current chemically amplified resist compositions for semiconductor microfabrication face challenges in achieving high resolution and good line edge roughness, as existing formulations do not adequately address the need for patterns with precise features and smooth edges.

Innovation Solution

A chemically amplified resist composition comprising specific salts and a resin with an acid-labile group, where the salts are represented by particular formulas and the resin becomes soluble in alkali solutions upon acid action, enhancing pattern resolution and edge smoothness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional acid generators are used in chemically amplified resist compositions, then the basic lithography function is maintained, but resolution and line edge roughness are insufficient for advanced semiconductor microfabrication

Engineering Contradiction:
Improvepattern resolution and line edge roughnessVSAvoidpattern formation quality
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the chemical parameters of the acid generator by using specific quaternary ammonium salts with defined structures (formula 1) and controlling the resin composition (formula 2) to achieve optimal pattern resolution and line edge roughness while maintaining reliable pattern formation

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite resist system combining specifically structured quaternary ammonium salts as acid generators with resins containing acid-labile groups, where the synergistic interaction between these components achieves both high resolution and good line edge roughness

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If the resist composition is optimized for high resolution, then pattern precision improves, but the complexity of formulation increases

Engineering Contradiction:
Improvepattern resolutionVSAvoidresist composition complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent optimizes specific parameters including the structural parameters of the quaternary ammonium salt (R1-R6 groups in formula 1) and the resin composition (formula 2), establishing precise compositional ranges that achieve high resolution without requiring overly complex formulations

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves improved resolution and line edge roughness, making it suitable for advanced lithography techniques such as ArF excimer laser lithography, KrF excimer laser lithography, and ArF immersion lithography.

Implementation Method 1

an acid generator comprising a compound generating an acid by irradiation

Methodology Applied
Scientific EffectPhotoirradiation-induced acid generation: Photopolymerisation

Data Source

PatentUS7803513B2Chemically amplified resist composition
Publication Date: 2010.09.28 SUMITOMO CHEM CO LTD
  • US7803513B2 patent drawing
  • US7803513B2 patent drawing
  • US7803513B2 patent drawing

AI summary

A chemically amplified resist composition comprising:(A) a salt represented by the formula (I):wherein R21 represents a C1-C30 hydrocarbon group etc., Q1 and Q2 each independently represent a fluorine atom etc., andA+ represents at least one organic cation selected from a cation represented by the formula (Ia):wherein P1, P2 and P3 each independently represent a C1-C30 alkyl group etc.,a cation represented by the formula (Ib):wherein P4 and P5 each independently represent a hydrogen atom etc., and a cation represented by the formula (Ic):wherein P10, P11, P12, P13, P14, P15, P16, P17, P18, P19, P20 and P21 each independently represent a hydrogen atom etc., B represents a sulfur or oxygen atom and m represents 0 or 1,(B) a salt represented by the formula (II):A′+−E  (II)wherein A′+ represents at least one organic cation selected from cations represented by the above-mentioned formulae (Ia), (Ib) and (Ic), and E− represents at least one organic anion selected from an anion represented by the formula (II-1):−O3SQ3  (II-1)wherein Q3 represents a C1-C10 perfluoroalkyl group, and an anion represented by the formula (II-2):wherein Q4 represents a C1-C10 perfluoroalkyl group, and(C) a resin which contains a structural unit having an acid-labile group and which itself is insoluble or poorly soluble in an aqueous alkali solution but becomes soluble in an aqueous alkali solution by the action of an acid.